Element Chip Dicing With Hydrophilic Resin Mask Adhesion
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Solution Overview
Problem
Conventional element chip manufacturing methods result in low die strength due to weakened adhesion at the substrate-protective film interface, leading to rough side surfaces and increased chipping during handling.
Innovation Solution
A method involving imparting hydrophilicity to a substrate surface, applying a water-soluble resin layer, using a laser to expose dicing regions, and plasma etching to obtain element chips, while maintaining high adhesion strength and precision, and removing the resin layer with a water-containing cleaning liquid.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a laser beam with high output power is applied to the protective film to enable plasma etching through the film, then the laser can penetrate the protective film and etch the substrate, but the adhesion strength at the interface between the substrate and protective film is weakened, causing rough side surfaces and reduced die strength
Solution Approach 1:
The patent applies a hydrophilic treatment to the substrate surface before forming the protective film. This preliminary action modifies the substrate surface properties to enhance adhesion strength, ensuring that even when high-power laser beams are used for etching, the protective film remains firmly attached and prevents chipping and rough side surfaces.
2Ease of manufacture
If a water-soluble resin protective film is used instead of a conventional protective film, then the protective film can be easily removed by water-containing cleaning liquid, but the adhesion strength may be insufficient when high-power laser beams are applied
Solution Approach 1:
The hydrophilic treatment is applied to the substrate surface before forming the water-soluble resin protective film. This preliminary modification of the substrate surface creates strong adhesion bonds that compensate for the potentially weaker adhesion of water-soluble resins, ensuring the film remains stable during high-power laser etching while maintaining easy removability with water-containing cleaning liquids.
Solution Approach 2:
The patent changes the surface parameters of the substrate by applying hydrophilic treatment, which modifies the surface energy and wettability. This parameter change enables the water-soluble resin to form strong adhesive bonds with the substrate, resolving the contradiction between ease of removal and adhesion strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the die strength of element chips by maintaining high adhesion and precision during plasma etching, reducing the risk of chipping and environmental burden.
Implementation Method 1
a first step of imparting hydrophilicity to a first surface of a substrate
Implementation Method 2
a third step of applying a laser beam to the water-soluble resin layer covering the dicing regions, to form openings that expose the dicing regions, in the water-soluble resin layer
Implementation Method 3
a fourth step of etching the dicing regions exposed at the openings, with plasma, to obtain a plurality of element chips
Implementation Method 4
a fifth step of removing the water-soluble resin layer by bringing the plurality of element chips into contact with a water-containing cleaning liquid
Data Source
AI summary
The disclosed element chip manufacturing method includes: a first step of imparting hydrophilicity to a first surface 11 of a substrate 1, the first surface 11 including element regions 11A and dicing regions 11B defining the element regions 11A; a second step of applying a raw material liquid containing a water-soluble resin onto the first surface 11, to form a water-soluble resin layer 20 on the first surface 11; a third step of applying a laser beam to the water-soluble resin layer 20 covering the dicing regions 11B, to form openings 20a that expose the dicing regions 11B, in the water-soluble resin layer 20; a fourth step of etching the dicing regions 11B exposed at the openings 20a, with plasma, to obtain element chips 30; and a fifth step of removing the water-soluble resin layer 20 by bringing the element chips 30 into contact with a water-containing cleaning liquid.