Element Embedded PCB Direct Electrode Contact
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Solution Overview
Problem
Conventional methods for manufacturing electronic component embedded printed circuit boards face challenges in creating finer circuit patterns and require additional layers for electrical connection, leading to thickness issues and reliability concerns.
Innovation Solution
The proposed solution involves an element embedded printed circuit board with a substrate having insulation layers, first and second circuit layers, and an element with an electrode part embedded in the insulation layer, where the electrode part is directly in contact with the first circuit layer, and conductive or non-conductive adhesive layers are used for connection, along with micro and penetration vias for electrical connectivity, eliminating the need for additional circuit layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional SAP method is used to embed electronic components in cavity, then electronic component can be embedded in printed circuit board, but additional circuit layer is required which increases board thickness and manufacturing complexity
Solution Approach 1:
The invention extracts and eliminates the additional circuit layer from the conventional SAP method by enabling direct contact between the embedded component electrode and the base circuit layer through the insulation layer, thereby simplifying the overall circuit board structure and reducing manufacturing complexity
Solution Approach 2:
The invention merges the electrical connection function directly into the insulation layer by forming a conductive pattern that extends from the base circuit layer through the insulation layer to contact the embedded component electrode, eliminating the need for a separate additional circuit layer
2Reliability
If additional circuit layer is added to connect electronic component, then electrical connection is achieved, but printed circuit board thickness increases
Solution Approach 1:
The invention transitions from a traditional layered horizontal connection approach to a vertical through-insulation connection approach, where the conductive pattern extends downward through the insulation layer to contact the embedded component electrode, achieving electrical connection without adding board thickness
3Ease of manufacture
If conventional embedding method is used, then electronic component can be fixed in cavity, but contact area is limited affecting electrical reliability
Solution Approach 1:
The invention performs preliminary action by forming the conductive pattern that extends through the insulation layer before the embedded component is fully positioned, ensuring that the conductive pattern is pre-aligned and ready to make optimal contact with the component electrode, thereby maximizing contact area and electrical reliability
Data Source
AI summary
An element embedded printed circuit board includes: a substrate including an insulation layer, a first circuit layer formed on a first surface of the insulation layer, and a second circuit layer formed on a second surface of the insulation layer; and an element including an electrode part and embedded in the insulation layer, wherein the electrode part is in contact with the first circuit layer.