Element Transfer Substrate With Elastic Protrusions for MicroLED Bonding
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Solution Overview
Problem
The existing methods for manufacturing electronic devices face challenges in achieving reliable electrical connections between microLED elements and bump electrodes due to inadequate control over the contact state between these components during the transfer process.
Innovation Solution
A method involving a substrate with an elastic deformation portion and protrusions is used to accurately control the contact between microLED elements and bump electrodes, where the substrate is pressed to adjust the contact state, and laser irradiation is applied to bond the elements securely.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If elements are transferred to electrodes on a substrate, then electronic device manufacturing is achieved, but electrical connection reliability between elements and bump electrodes deteriorates due to inadequate control over contact state
Solution Approach 1:
The patent employs an elastic deformation portion that can dynamically adjust its shape in response to contact with bump electrodes. This elastic structure transitions from a non-contact state to a contact state, enabling precise control over the contact between element electrodes and bump electrodes during the transfer process, thereby improving electrical connection reliability.
Solution Approach 2:
The patent changes the physical state of the elastic deformation portion from non-contact to contact by applying external force or adjusting positioning parameters. This parameter change enables controlled contact between the element electrodes and bump electrodes, ensuring reliable electrical connections while maintaining manufacturing precision.
2Manufacturing precision
If protrusions are added to the elastic deformation portion, then contact state control precision is improved, but device complexity increases
Solution Approach 1:
The elastic deformation portion is segmented into multiple protrusions, each capable of independently contacting bump electrodes. This segmentation allows precise control over contact states at multiple locations simultaneously, improving manufacturing precision without requiring a completely complex substrate structure.
Solution Approach 2:
The patent uses an elastic deformation portion with protrusions that functions as a flexible structure. This flexible design enables the protrusions to adaptively contact bump electrodes, achieving precise contact state control while maintaining a relatively simple overall substrate structure compared to rigid alternative designs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability of electrical connections by precisely adjusting the contact state and ensuring strong bonding between microLED elements and bump electrodes, improving the overall performance of the electronic device.
Implementation Method 1
an elastic deformation portion fixed on the first surface of the first substrate and made of an elastically deformable material
Implementation Method 2
irradiating with laser a plurality of contact portions at which the plurality of bump electrodes and the electrodes of the plurality of elements are in contact with each other to join the element electrodes and the bump electrodes irradiated with the laser together
Data Source
AI summary
Performance of an electronic device is improved. A substrate for transfer includes a substrate having a surface and made of a visible light transmitting material, and an elastic deformation portion fixed on the surface of the substrate, transmitting visible light, and made of an elastically deformable material. The elastic deformation portion includes a plurality of element holding portions, and a plurality of protrusions arranged at positions not overlapping with the plurality of element holding portions, and protruding higher than the plurality of element holding portions when the surface of the substrate is a reference plane.