Elevated Conductive Pad for Semiconductor Alignment
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Solution Overview
Problem
As the pitch of conductive elements in semiconductor structures decreases to accommodate increasing I/O pins, alignment of interconnections becomes increasingly challenging, leading to manufacturing speed suppression and potential damage to conductive pillars.
Innovation Solution
The semiconductor device package incorporates an elevated conductive pad that is higher than other pads, allowing for precise alignment and connection of conductive pillars, reducing alignment tolerance and preventing pillar damage from dielectric layers, while also increasing manufacturing speed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the pitch of conductive elements is reduced to accommodate increasing I/O pins, then the quantity of I/O pins increases, but the alignment precision of interconnections deteriorates
Solution Approach 1:
The conductive pad is elevated in the vertical dimension (z-axis) relative to the electronic component surface, creating a height difference that provides a larger alignment target for conductive pillars. This dimensional change transforms the alignment problem from a two-dimensional planar alignment to a three-dimensional alignment, where the elevated pad top surface serves as a more prominent alignment reference that compensates for the reduced pitch between conductive elements.
2Quantity of substance
If the pitch of conductive elements is reduced, then more I/O pins can be accommodated, but manufacturing speed decreases
Solution Approach 1:
The conductive pad is formed in advance (prior to bonding) with an elevated structure that pre-establishes the alignment reference. This preliminary formation of the elevated pad structure eliminates the need for time-consuming alignment adjustments during the bonding process, thereby maintaining high manufacturing speed even as the number of I/O pins increases through pitch reduction.
3Quantity of substance
If the pitch of conductive elements is reduced, then more I/O pins can be accommodated, but the risk of conductive pillar damage increases
Solution Approach 1:
The elevated conductive pad acts as an intermediary structure between the electronic component and the conductive pillar. The dielectric layer covering the lateral surface of the elevated pad serves as a protective intermediary that prevents direct contact and potential damage between the conductive pillar and the electronic component, while still allowing for precise alignment and electrical connection.
4Device complexity
If conventional planar pads are used, then the structure is simple, but alignment accuracy deteriorates
Solution Approach 1:
The conductive pad transitions from a conventional planar (2D) structure to an elevated (3D) structure with a top surface that extends beyond the lateral surface. This dimensional enhancement provides a larger alignment target area without significantly increasing overall structural complexity, thereby improving alignment accuracy while maintaining manufacturing feasibility.
Data Source
AI summary
A semiconductor device package includes a first electronic component having a first surface and a second surface opposite the first surface. The semiconductor device package further includes a first pad disposed on the first surface of the first electronic component. The first pad has a first surface facing away from the first surface of the first electronic component, a second surface opposite the first surface of the first pad, and a lateral surface extended between the first surface of the first pad and the second surface of the first pad. The semiconductor device package further includes a second pad disposed on the first surface of the first pad. The second pad has a first surface facing away from the first surface of the first pad, a second surface opposite the first surface of the second pad, and a lateral surface extended between the first surface of the second pad and the second surface of the second pad. A width of the first surface of the second pad is greater than a width of the second surface of the second pad. A method of manufacturing a semiconductor device package is also disclosed.