Elevated Die Shielding Structure for Compact EMI Isolation
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Solution Overview
Problem
Device packages face challenges in reducing electromagnetic interference (EMI) between components like oscillators and semiconductor dies, which can affect the operation of sensitive components, and existing shielding structures often increase the package footprint.
Innovation Solution
A shielding structure with elevated platforms and fingers is mounted between the EMI-generating components and semiconductor dies, providing electromagnetic shielding and allowing wire bonding through defined windows, and is electrically coupled to the circuit board's ground plane for enhanced shielding efficacy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shielding structure is provided between EMI-generating components and sensitive semiconductor die, then electromagnetic interference is reduced, but the package footprint increases
Solution Approach 1:
The patent transitions from planar shielding to three-dimensional shielding by elevating the semiconductor die on posts above the circuit board plane. The shielding structure extends vertically with side walls rising from the board surface, creating a volumetric shield rather than a two-dimensional barrier. This vertical dimensionality allows EMI protection without proportionally increasing the horizontal footprint area.
Solution Approach 2:
The shielding structure is nested within the existing package footprint by integrating the side walls and top surface directly into the vertical space above the circuit board. The elevated die sits within the confines formed by the rising side walls, nesting the sensitive component within the protective shield volume without requiring additional lateral space.
2Object-affected harmful factors
If a shielding structure is provided between EMI-generating components and sensitive semiconductor die, then electromagnetic interference is reduced, but device complexity increases
Solution Approach 1:
The shielding structure is segmented into distinct functional portions: vertical side walls for lateral EMI blocking, a top surface for overhead shielding, and integrated posts for mechanical support and die mounting. This segmentation allows each portion to be optimized for its specific shielding function while simplifying the overall design by breaking down the complex shielding requirement into manageable geometric segments.
Solution Approach 2:
The elevated platform structure serves multiple functions simultaneously: it provides mechanical support for the die via integrated posts, creates lateral EMI shielding through vertical side walls, provides overhead EMI protection through the top surface, and establishes electrical connection pathways. This multi-functionality reduces device complexity by consolidating what would otherwise require separate components into a single integrated shielding structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The shielding structure effectively reduces EMI while maintaining a compact package footprint by elevating the semiconductor die and providing direct electrical connections, thereby improving the operational stability of sensitive components.
Implementation Method 1
a shielding structure mounted to the circuit board and having a first platform elevated over the circuit board... wherein the shielding structure is between the first component and the semiconductor die
Data Source
AI summary
One or more structures and/or methods are provided. In an example of the subject matter presented herein, an apparatus includes a circuit board, a first component mounted to the circuit board, a shielding structure mounted to the circuit board and having a first platform elevated over the circuit board, and a semiconductor die mounted to the first platform, wherein the shielding structure is between the first component and the semiconductor die.