Elevated Floating Diffusion Structure for Low-Leakage Image Sensors

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Solution Overview

Problem

CMOS image sensors face issues with floating diffusion leakage, leading to high dark current, sensor noise, and reduced image quality due to highly doped floating diffusion regions causing gate induced drain leakage and Trap-Assisted-Tunneling leakage.

Innovation Solution

An elevated floating diffusion region is formed by separating a doped floating diffusion region from the semiconductor substrate with an undoped or lightly doped intervening layer, reducing leakage by avoiding abrupt junctions and silicon damage, and providing an ohmic contact.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a highly doped floating diffusion region is used, then the photosensitivity and charge collection efficiency are improved, but gate induced drain leakage and junction leakage increase

Engineering Contradiction:
ImprovephotosensitivityVSAvoidleakage current
Core Design Contradiction:
Measurement precisionVSObject-generated harmful factors

Solution Approach 1:

The floating diffusion region is segmented into multiple doping zones with different doping concentrations. A lightly doped or undoped region is positioned between the highly doped floating diffusion and the substrate, creating a gradient structure that reduces abrupt junctions and associated leakage while preserving photosensitivity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the floating diffusion structure are assigned different doping qualities: the surface region maintains high doping for charge collection, while the deeper region transitions to lighter doping to reduce leakage. This local differentiation resolves the contradiction between photosensitivity and leakage suppression.

Inventive Principle:
Principle #3Local quality

2Productivity

If device geometries are scaled down, then fabrication costs decrease and device integration density increases, but defects become more apparent and image quality deteriorates

Engineering Contradiction:
Improvedevice integration densityVSAvoidimage quality
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The doping concentration parameter is changed spatially within the floating diffusion region, transitioning from uniform high doping to a graded structure with lighter doping deeper in the substrate. This parameter modification reduces leakage defects that become more prominent at scaled dimensions while maintaining the high integration density.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach minimizes diffusion leakage, enhancing image quality, yield, and speed by suppressing gate induced drain leakage and junction leakage, thereby improving the performance of CMOS image sensors.

Implementation Method 1

Photosensitive elements included in the image sensor, such as photodiodes, each generate image charge upon absorption of the image light

Methodology Applied
Scientific EffectPhotoelectric effect: Photoelectric Effect

Data Source

PatentUS11869906B2Image sensor with elevated floating diffusion
Publication Date: 2024.01.09 OMNIVISION TECHNOLOGIES INC
  • US11869906B2 patent drawing
  • US11869906B2 patent drawing
  • US11869906B2 patent drawing

AI summary

A pixel cell with an elevated floating diffusion region is formed to reduce diffusion leakage (e.g., gate induced drain leakage, junction leakage, etc.). The floating diffusion region can be elevated by separating a doped floating diffusion region from the semiconductor substrate by disposing an intervening layer (e.g., undoped, lightly doped, etc.) on the semiconductor substrate and beneath the doped floating diffusion region. For instance, the elevated floating diffusion region can be formed by stacked material layers composed of a lightly or undoped base or intervening layer and a heavy doped (e.g., As doped) “elevated” layer. In some examples, the stacked material layers can be formed by first and second epitaxial growth layers.