Elevated Air-Cooled Heat Exchanger Layout to Limit Air Recirculation

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Solution Overview

Problem

Existing thermal management systems for computing devices face challenges in efficiently dissipating heat due to recirculation of cooling air, which affects heat transfer performance.

Innovation Solution

The system elevates the air-cooled heat exchanger above the fluid tanks and incorporates a fan configuration to direct cooling air away from the heat exchanger, reducing recirculation and enhancing heat transfer efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the air-cooled heat exchanger is positioned at ground level, then the system structure is simpler and easier to install, but cooling air recirculation occurs which reduces heat transfer performance

Engineering Contradiction:
Improveease of installationVSAvoidheat transfer performance
Core Design Contradiction:
Ease of manufactureVSProductivity

Solution Approach 1:

The heat exchanger is elevated from ground level to an elevated position above the fluid tanks, transitioning from a two-dimensional ground-level arrangement to a three-dimensional vertical arrangement. This dimensional change allows cooling air to be discharged above the heat exchanger rather than at ground level, preventing recirculation and improving heat transfer performance while maintaining installation feasibility through standard elevation structures.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If the heat exchanger is elevated above the fluid tanks, then cooling air recirculation is minimized improving heat transfer, but the system complexity increases

Engineering Contradiction:
Improveheat transfer performanceVSAvoidsystem structure complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The elevated position of the heat exchanger serves multiple functions simultaneously: it prevents cooling air recirculation by discharging air above the heat exchanger, improves heat transfer performance, and allows the fluid tanks to be positioned below for optimal fluid dynamics. This multi-functional arrangement achieves improved performance without proportionally increasing system complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Device complexity

If cooling air is discharged at ground level, then the fan structure is simpler, but the discharged air recirculates through the heat exchanger reducing efficiency

Engineering Contradiction:
Improvefan structure complexityVSAvoidcooling efficiency
Core Design Contradiction:
Device complexityVSLoss of energy

Solution Approach 1:

The fan discharges cooling air vertically upward in the vertical dimension rather than horizontally at ground level. This dimensional change in air discharge direction allows the air to rise above the heat exchanger and be discharged over the surrounding area, eliminating recirculation and improving cooling efficiency without requiring complex fan structures.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration improves heat transfer performance by minimizing recirculation of cooling air, thereby increasing the effectiveness of thermal management systems for computing devices.

Implementation Method 1

Each fluid tank is configured to hold a group of computing devices over the plurality of apertures... configured to receive the dielectric fluid

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

A pump is configured to circulate the dielectric fluid through the fluid circulation system... remove thermal energy from the dielectric fluid

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 3

The air-cooled heat exchanger is in fluid communication with the plurality of fluid tanks and is configured to receive the dielectric fluid... remove thermal energy from the dielectric fluid

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 4

A fan is configured to circulate air through the air-cooled heat exchanger so as to remove thermal energy from the dielectric fluid

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS12477684B1Fluid circulation systems and cooling facilities with elevated heat exchanger
Publication Date: 2025.11.18 RHODIUM TECH LLC
  • US12477684B1 patent drawing
  • US12477684B1 patent drawing
  • US12477684B1 patent drawing

AI summary

A fluid circulation system for cooling a plurality of computing devices with a dielectric includes a plurality of fluid tanks, an air cooled heat exchanger, a fan and a pump. Each fluid tank includes a bottom having a plurality of apertures for receiving the dielectric fluid. Each fluid tank is configured to hold a group of computing devices over the plurality of apertures. The air-cooled heat exchanger is elevated at least fifteen feet over a support surface. The air-cooled heat exchanger is in fluid communication with the plurality of fluid tanks and is configured to receive the dielectric fluid. The fan is configured to circulate air through the air-cooled heat exchanger so as to remove thermal energy from the dielectric fluid. The pump is configured to circulate the dielectric fluid through the fluid circulation system.