Elevated Inductor Power Module Layout for Denser Decoupling
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Solution Overview
Problem
The limited space under ICs for vertical power delivery modules restricts the number of decoupling capacitors, leading to inferior transient performance and increased IR loss in conventional power delivery solutions.
Innovation Solution
Elevating inductors above the surface of the power module allows for capacitors to be arranged underneath, increasing the number of capacitors and reducing IR loss, thereby enhancing transient performance and power delivery efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If decoupling capacitors are placed on the same side of the PCB as the IC, then the area under the IC is saved, but the transient performance of the power rail suffers from reduced capacitance
Solution Approach 1:
The patent moves decoupling capacitors from the traditional planar arrangement on the PCB surface to a three-dimensional configuration by placing them underneath elevated inductors. This vertical stacking approach utilizes the Z-dimension (height) to accommodate additional capacitance without increasing the footprint area, thereby resolving the contradiction between limited area and required transient performance.
2Reliability
If more decoupling capacitors are included on the power module, then transient performance improves, but the surface area of the power module increases
Solution Approach 1:
The patent implements a nested configuration where decoupling capacitors are positioned underneath elevated inductors, effectively nesting one component within the spatial envelope of another. This allows multiple capacitors to be accommodated within the vertical space occupied by the inductor structure, increasing total capacitance without proportionally increasing the power module's surface area.
3Quantity of substance
If inductors are elevated above the PCB surface, then more capacitors can be arranged underneath, but the structural complexity of the power module increases
Solution Approach 1:
The patent employs segmentation by dividing the inductor structure into discrete mounting posts that elevate the inductor body above the PCB surface. This segmentation allows the inductor to be supported at specific points rather than requiring a continuous complex structure, simplifying the overall design while creating the necessary vertical space for capacitor placement underneath.
Data Source
AI summary
The disclosure relates to power modules that include elevated inductors with capacitors disposed under the inductors. In one aspect, a power module includes a first circuit board having a first surface and a second surface opposite the first surface. One or more inductors are mounted on the first surface. Each of the one or more inductors includes a top surface and a bottom surface opposite the top surface and that faces the first surface of the first circuit board. Each inductor is elevated above the first surface of the first circuit board such that at least a portion of the bottom surface of the inductor does not contact the first surface of the first circuit board. The first circuit board includes capacitors arranged in an area below the portion of the bottom surface of the inductor that does not contact the first surface of the first circuit board.