Elevated Lead Package Structure for Reliable Bottom-Side Coupling
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Solution Overview
Problem
Conventional packaging solutions for electronic components face challenges in achieving high reliability and performance due to issues with electric and mechanical coupling between the package and the mounting base, leading to limitations in signal integrity and energy efficiency.
Innovation Solution
A package design featuring elevated leads extending downwardly from the encapsulant, with a functional structure at the bottom side that extends to a different vertical level, ensuring a reliable electric connection and reducing signal losses, and incorporating a functional structure that enhances creepage distance and prevents unintended solder flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging solutions are used with standard lead configuration, then manufacturing simplicity is maintained, but electric and mechanical coupling reliability between package and mounting base is insufficient
Solution Approach 1:
The patent applies dimensionality change by extending leads vertically downward from the bottom side of the encapsulant rather than only laterally from sides. This vertical extension into the third dimension improves electric and mechanical coupling with the mounting base while maintaining a compact horizontal footprint, thus enhancing reliability without proportionally increasing overall device complexity
Solution Approach 2:
The package structure is segmented into distinct functional zones: the encapsulant body, the elevated lead portions extending downward, and the functional structure at the bottom side. This segmentation allows each component to be optimized independently for its specific function while working together to achieve reliable coupling
2Reliability
If leads are extended downwardly from encapsulant bottom side, then electric connection reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The patent merges the lead extension and functional structure formation into a single integrated process step. The functional structure is formed simultaneously with the downward extension of leads from the encapsulant bottom side, combining what could be separate manufacturing operations into one unified process, thereby improving electric connection reliability while minimizing the increase in manufacturing complexity
3Reliability
If functional structure extends to different vertical level, then creepage distance is enhanced, but device dimensions increase
Solution Approach 1:
The functional structure is implemented with local quality by extending only in specific regions where creepage enhancement is most needed, rather than uniformly across the entire bottom side. This localized extension achieves the required creepage distance while minimizing the overall vertical dimension increase of the package
Data Source
AI summary
A package is disclosed. In one example, the package comprises a carrier, an electronic component mounted on the carrier, an encapsulant encapsulating at least part of the electronic component and at least part of the carrier and having a bottom side at a first vertical level. At least one lead is electrically coupled with the electronic component and comprising a first lead portion being encapsulated in the encapsulant and a second lead portion extending out of the encapsulant at the bottom side of the encapsulant. A functional structure at the bottom side extends up to a second vertical level different from the first vertical level.