Elevated PCB Temperature Sensor for Accurate Ambient Sensing
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Solution Overview
Problem
Conventional surface-mounted digital temperature sensors on network devices suffer from accuracy loss due to external influences from nearby electrical components and thermal dissipation from the PCB, limiting their ability to accurately measure ambient temperatures.
Innovation Solution
The temperature sensor is elevated or raised above the surface of the printed circuit board by incorporating it into a plug-in module with a connector that protrudes from the board, providing thermal isolation through cutouts and an exposed metal pad coupled via a conductive path, allowing it to measure ambient temperatures more accurately.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the temperature sensor is surface-mounted directly onto the PCB, then the device complexity is reduced and manufacturing is simplified, but the measurement precision deteriorates due to thermal dissipation from the PCB and external influence from nearby electrical components
Solution Approach 1:
The temperature sensor is elevated from the PCB surface by mounting it on a support structure that extends vertically from the board. This dimensional transition from surface-level to elevated positioning creates thermal isolation from the PCB, allowing accurate ambient temperature measurement while maintaining a relatively simple overall device structure.
Solution Approach 2:
A support structure with cutouts acts as an intermediary between the temperature sensor and the PCB. This intermediary structure provides thermal isolation by preventing direct thermal contact with the PCB, thereby enabling accurate temperature sensing without requiring complex active cooling or shielding mechanisms.
2Measurement precision
If the temperature sensor is elevated above the PCB surface using a support structure with cutouts, then the measurement precision improves by reducing thermal influence from the PCB, but the device complexity increases due to the additional mounting structure
Solution Approach 1:
The support structure utilizes the vertical dimension to elevate the temperature sensor above the PCB surface. This vertical positioning creates natural thermal isolation without requiring complex horizontal arrangements or additional active thermal management components, thereby improving measurement precision with minimal added complexity.
Solution Approach 2:
The support structure incorporates cutouts specifically at locations where thermal influence from the PCB would be most significant. This localized modification provides thermal isolation precisely where needed, rather than requiring complete structural redesign, thus achieving improved measurement accuracy with minimal increase in overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the accuracy of temperature measurement by minimizing the influence of the PCB surface temperature, enabling better ambient temperature sensing within the network device.
Implementation Method 1
The temperature sensor is elevated or raised above a surface of the main printed circuit board... providing thermal isolation through cutouts and an exposed metal pad
Data Source
AI summary
A network device that includes a temperature sensor module is provided. The network device can include a host printed circuit board, one or more processors mounted on a surface of the host printed circuit board, a port protruding from the surface of the host printed circuit board, and a temperature sensor module that is raised over the surface of the host printed circuit board to provide thermal decoupling from the surface of the host printed circuit board. The temperature sensor module can include a sensor printed circuit board, a temperature sensor integrated circuit die disposed on a first side of the sensor printed circuit board, and an exposed conductive pad disposed on a second side of the sensor printed circuit board. The temperature sensor module can include multiple exposed contacts or a plug configured to mate with the protruding port.