Elevated Terminal Structure for Reliable ACF Contact
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Solution Overview
Problem
High terminal density in hard disk drives and other electronic devices leads to reduced contact between terminals and anisotropic conductive films, resulting in unreliable electric connections due to protrusions of the cover insulating layer.
Innovation Solution
A terminal connection structure featuring a base insulating layer, a cover insulating layer, and a wiring pattern with terminals that expose outside the cover layer and are supported by a protruding support portion, ensuring stable contact with the anisotropic conductive film even at high terminal densities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If terminals are arranged with high density to accommodate more functions in downsized HDD, then the number of terminals increases, but the protrusion of the cover insulating layer reduces the contact degree between terminals and anisotropic conductive film, decreasing connection reliability
Solution Approach 1:
The patent introduces a support portion that protrudes from the base insulating layer in the vertical dimension, creating a stepped structure. This dimensional change allows terminals to be positioned at different heights, with elevated terminals protruding above the cover insulating layer surface to ensure adequate contact with the anisotropic conductive film, while lower terminals remain covered. This resolves the contradiction by enabling high terminal density without compromising connection reliability.
Solution Approach 2:
The patent applies different structural treatments to different terminals based on their specific needs. Terminals requiring reliable contact with the anisotropic conductive film are provided with support portions that elevate them, while other terminals remain at the base level. This localized differentiation allows high terminal density while ensuring that critical connections maintain sufficient contact area, resolving the reliability issue without preventing terminal proliferation.
2Object-affected harmful factors
If the cover insulating layer is made to surround terminals for insulation protection, then insulation performance improves, but the contact area between terminals and anisotropic conductive film is reduced
Solution Approach 1:
The patent segments the insulating structure into two distinct parts: a base insulating layer that provides overall insulation and structural support, and a cover insulating layer that provides localized insulation protection. By dividing the insulating function across these two layers, the base insulating layer can be made thicker for better insulation without compromising the contact area, as the elevated terminals protrude through the cover insulating layer's coverage area.
Solution Approach 2:
The support portion creates a vertical dimension that allows the cover insulating layer to surround terminals laterally for insulation while terminals themselves protrude vertically above the cover layer. This dimensional separation enables the cover insulating layer to provide insulation protection without reducing the vertical contact area between terminals and the anisotropic conductive film.
Data Source
AI summary
A terminal connection structure includes a first connection and a second connection connected to each other through an anisotropic conductive film. At least one of the first and second connections comprises terminals arranged side by side at an end of a wiring pattern formed between base and cover insulating layers to expose outside the cover insulating layer, and a support portion protruding relative to a part of the base insulating layer in a surrounding area of a respective one of the terminals.