Elliptical Column Package-on-Package Structure for Torque Resistance
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Solution Overview
Problem
Ensuring the reliability of integrated fan-out packages, which face challenges due to the compactness and complexity of their design, particularly in maintaining electrical connections and mechanical integrity under torque forces during encapsulation.
Innovation Solution
The use of elliptical columns and conical frustums as conductive structures, strategically arranged and oriented to resist torque forces, combined with the formation of ellipsoidal joint terminals, enhances the structural integrity and connectivity of the package, ensuring reliable electrical connections and mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional conductive structures are used in integrated fan-out packages, then manufacturing is simpler, but reliability under torque forces during encapsulation deteriorates
Solution Approach 1:
The patent employs asymmetric conductive structures including elliptical columns and conical frustums with specific geometric parameters. These asymmetric shapes are strategically oriented to resist torque forces generated during encapsulation, thereby improving package reliability without requiring overly complex manufacturing processes
Solution Approach 2:
The patent utilizes curved and rounded conductive structures such as elliptical columns and conical frustums instead of sharp-edged geometries. These curved structures better distribute stress and torque forces during encapsulation, enhancing reliability while maintaining manufacturability through standard semiconductor fabrication processes
2Area of stationary object
If compact package design is implemented, then area utilization improves, but mechanical integrity under torque forces deteriorates
Solution Approach 1:
The patent transitions from two-dimensional planar conductive structures to three-dimensional forms including elliptical columns and conical frustums. This dimensional enhancement provides additional mechanical strength and torque resistance while maintaining compact footprint, allowing small packages to withstand encapsulation forces
Solution Approach 2:
The patent employs composite conductive structures combining multiple materials and geometries (elliptical columns, conical frustums, and ellipsoidal joint terminals) to achieve both compactness and mechanical integrity. These composite structures optimize space utilization while providing sufficient strength against torque forces
3Force
If elliptical columns and conical frustums are used, then resistance to torque forces improves, but manufacturing precision requirements increase
Solution Approach 1:
The patent specifies optimized geometric parameters for elliptical columns and conical frustums that balance torque resistance with manufacturability. By carefully selecting dimensions, aspect ratios, and orientations, the design achieves force resistance while remaining compatible with standard semiconductor manufacturing precision capabilities
Solution Approach 2:
The conductive structures serve multiple functions simultaneously: they provide electrical connectivity, mechanical support, and torque resistance. This multi-functionality reduces the need for additional specialized components, thereby lowering overall manufacturing precision requirements while maintaining force resistance
Data Source
AI summary
A package includes a die, first conductive structures, second conductive structures, and an encapsulant. The die has a rear surface. The first conductive structures and the second conductive structures surround the die. The first conductive structures include cylindrical columns and the second conductive structures include elliptical columns. At least one of the second conductive structures is closer to the die than the first conductive structures. The encapsulant encapsulates the die, the first conductive structures, and the second conductive structures.