Elliptical Micro-LED Package for Simultaneous RGB Assembly
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Solution Overview
Problem
Micro-LED display manufacturing faces challenges in transfer speed, high transfer error rates, long process times, and reduced color gamut due to non-uniform DEP force and separate assembly processes for red, green, and blue light emitting devices, which hinder the achievement of ultra-high resolution and flexible display capabilities.
Innovation Solution
A semiconductor light emitting device package with an elliptical shape and a common electrode wiring system that connects multiple light emitting devices, allowing for simultaneous assembly and improved electrical connections, along with a color conversion layer for enhanced color accuracy, and a magnetic layer for increased assembly speed and precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If separate assembly processes are used for red, green, and blue light emitting devices, then each device can be assembled with optimal positioning, but the total process time becomes very long and transfer efficiency decreases
Solution Approach 1:
The patent combines multiple separate assembly processes for red, green, and blue light emitting devices into a single simultaneous assembly process. Multiple light emitting devices of different colors are assembled together in one operation, reducing the total process time while maintaining positioning accuracy through integrated alignment mechanisms.
Solution Approach 2:
The patent employs preliminary positioning structures such as alignment marks, pre-formed electrode pads, and predetermined device orientations that enable accurate positioning to be achieved during the simultaneous assembly process, eliminating the need for separate positioning steps for each device type.
2Productivity
If transfer speed is increased to improve productivity, then manufacturing efficiency improves, but the transfer error rate increases and transfer yield decreases
Solution Approach 1:
The patent implements self-alignment mechanisms where the light emitting devices automatically position themselves during transfer through features such as complementary shapes between devices and substrate, magnetic alignment, or electrostatic attraction, enabling high-speed transfer without sacrificing accuracy.
Solution Approach 2:
The patent changes physical parameters such as using magnetic fields, electrostatic fields, or fluid dynamics to control device positioning during transfer, allowing for rapid and accurate placement simultaneously, thereby improving both transfer speed and accuracy.
3Manufacturing precision
If the distance between assembly holes of sub-pixels is reduced to achieve ultra-high resolution, then display resolution improves, but the pixel size becomes difficult to reduce further
Solution Approach 1:
The patent employs nested packaging structures where multiple light emitting devices are arranged in a compact configuration within each pixel, allowing closer spacing of assembly holes while maintaining adequate device size and electrical connection requirements, thereby enabling ultra-high resolution displays.
Solution Approach 2:
The patent transitions from planar arrangement to three-dimensional stacking or multi-layer configurations of light emitting devices, allowing reduced horizontal distance between assembly holes while maintaining functional performance through vertical integration and shared electrode structures.
4Productivity
If simultaneous assembly of red, green, and blue light emitting devices is implemented to shorten process time, then assembly speed improves, but color gamut is reduced due to shape and size differences
Solution Approach 1:
The patent segments the simultaneous assembly process into distinct zones or groups for different device types, with dedicated alignment and positioning structures for each color, allowing uniform positioning accuracy for each device type while maintaining overall simultaneous assembly efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances assembly speed, reduces defects, and improves color gamut by enabling simultaneous assembly of multiple light emitting devices, increasing transfer efficiency, and allowing for ultra-high resolution displays while maintaining flexible display capabilities.
Implementation Method 1
a magnetic layer for increased assembly speed and precision
Implementation Method 2
a self-assembly type transfer process using dielectrophoresis (DEP)
Data Source
AI summary
A semiconductor light emitting device package can include a first layer having a first region and a second region surrounding the first region, a common electrode wiring on the first region of the first layer, a plurality of semiconductor light emitting devices on the common electrode wiring, a plurality of electrode wirings on upper sides of the plurality of semiconductor light emitting devices, a plurality of electrode pads on the second region of the first layer, and a second layer on the plurality of semiconductor light emitting devices, the plurality of electrode wirings, and the plurality of electrode pads. The first layer and the second layer can have an elliptical shape. The plurality of electrode pads can include a first electrode pad, a second electrode pad, a third electrode pad, and at least one or more common electrode pads.