Elongated Semiconductor Chip Bank Arrangement
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Solution Overview
Problem
Current semiconductor devices face challenges in maximizing memory capacity within limited package sizes while ensuring efficient testing and packaging, and existing designs often result in suboptimal data input/output performance due to complex bank structures and peripheral circuit arrangements.
Innovation Solution
The semiconductor device incorporates a cell area divided into multiple banks of varying sizes, with a specific arrangement of peripheral areas and chip pads to facilitate efficient data transfer and packaging, allowing for a rectangular chip shape that can be stacked to increase memory capacity while adhering to standard package sizes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the cell area is divided into multiple banks of varying sizes to maximize memory capacity within limited package size, then memory capacity is improved, but the complexity of bank structure and peripheral circuit arrangement increases, leading to suboptimal data input/output performance
Solution Approach 1:
The cell area is divided into multiple banks of varying sizes (first banks with base size and second banks with 1/(2*n) of base size) to maximize memory capacity within limited package size. The peripheral area is segmented into multiple peripheral areas, each directly adjacent to different banks, enabling independent access and reducing overall system complexity despite the varied bank structure.
Solution Approach 2:
The chip is designed with an elongated rectangular shape extending in a second direction perpendicular to the first direction. Multiple peripheral areas extend in the first direction and are positioned at different locations around the cell area, utilizing two-dimensional spatial arrangement to optimize both capacity and access efficiency without increasing linear dimensions excessively.
2Productivity
If multiple peripheral areas are arranged to be directly adjacent to different banks to improve data input/output efficiency, then data transfer efficiency is improved, but the complexity of peripheral circuit arrangement increases
Solution Approach 1:
The peripheral area is divided into multiple separate peripheral areas, with each peripheral area directly adjacent to and serving specific banks. This segmentation allows parallel data input/output operations across different banks simultaneously, improving overall productivity while keeping each peripheral circuit module relatively simple and manageable.
Solution Approach 2:
Each peripheral area is designed to serve multiple banks (first banks and second banks) through universal interface circuits that can handle data input/output operations for different bank types. This multi-functionality reduces the need for dedicated complex circuits for each bank, simplifying the overall peripheral circuit arrangement while maintaining high data transfer efficiency.
3Ease of manufacture
If chip pads are arranged in an 'L' shape adjacent to outer edge of chip to simplify testing and packaging, then ease of packaging is improved, but the area available for memory cells decreases
Solution Approach 1:
The chip pads are arranged in an asymmetric 'L' shape along the outer edge of the elongated rectangular chip, concentrated at one end rather than distributed uniformly. This asymmetric arrangement simplifies packaging and testing operations by providing集中 access points, while the elongated chip shape compensates for the pad area by offering extended space for memory cell arrangement in the perpendicular direction.
Solution Approach 2:
The chip utilizes its elongated rectangular shape to compensate for the area occupied by L-shaped pads. By extending the chip in the second direction perpendicular to the first direction, the design creates additional space for memory cells along the length of the chip, offsetting the area loss from the pad arrangement while maintaining packaging simplicity.
Data Source
AI summary
A semiconductor device includes a cell area in which a plurality of memory cells are arranged in an array structure, and a peripheral area in which circuits configured to drive the memory cells are arranged, the peripheral area being next to the cell area. The cell area is divided into a plurality of banks, and the plurality of banks comprise first banks having a base size and second banks having a size of 1/(2*n) (wherein n is an integer greater than or equal to 1) of the base size. The plurality of banks are arranged in a first direction and a second direction perpendicular to the first direction, and the semiconductor device has a shape of a rectangular chip which is elongated in the second direction.