Elongated Solder Resist Patterns for 3D Circuit Devices
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Solution Overview
Problem
Existing methods for mounting electronic components on three-dimensional circuit devices, such as molded interconnect devices (MIDs), face challenges in applying solder resist patterns due to the complex and small surface area, leading to difficulties in preventing solder spread and ensuring reliable bonding.
Innovation Solution
The use of elongated solder resist patterns placed using a dispenser, which are orthogonal to conductor patterns, creates solder-non-wetting areas to control solder spread, allowing for precise and reliable soldering of electronic components on the three-dimensional circuit device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional solder resist patterns are applied to three-dimensional circuit devices, then solder spread prevention is improved, but manufacturing complexity increases due to the complex and small surface area
Solution Approach 1:
The solder resist pattern is designed with varying local properties: elongated shapes positioned strategically around conductor pads, with widths and lengths optimized for specific locations. This local differentiation allows effective solder containment on complex three-dimensional surfaces without requiring uniformly complex manufacturing processes across the entire device.
Solution Approach 2:
The solder resist pattern is divided into multiple discrete elongated segments rather than a continuous pattern. Each segment is independently positioned to control solder flow in specific areas, simplifying the manufacturing process while maintaining effective solder spread prevention across the complex three-dimensional surface.
2Reliability
If solder resist patterns are used to prevent solder spread, then bonding reliability is improved, but the process difficulty increases on complex three-dimensional surfaces
Solution Approach 1:
The solder resist pattern parameters (length, width, orientation) are optimized for three-dimensional surfaces. Elongated patterns with specific aspect ratios are used to accommodate the curved and irregular geometries of MID devices, allowing standard manufacturing techniques to achieve reliable solder containment without excessive process complexity.
3Manufacturing precision
If photolithography or screen-printing is used to place resist patterns, then pattern precision is improved, but applicability to three-dimensional surfaces deteriorates
Solution Approach 1:
The solder resist pattern transitions from traditional two-dimensional flat patterns to three-dimensional elongated structures that conform to the curved and irregular surfaces of MID devices. This dimensional adaptation allows the pattern to maintain precision while being applicable to complex three-dimensional geometries through conformal coating techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables efficient and reliable soldering of electronic components on complex three-dimensional surfaces, ensuring high-performance electronic devices by preventing solder wetting on undesired areas and maintaining strong bonding.
Implementation Method 1
The resist pattern is placed by patterning a spin-coated resist or a film resist using a photolithography method. The resist pattern is sometimes placed by screen-printing of the resist.
Implementation Method 2
at least two solderless portions arranged to be spaced apart from each other by a second distance in a second direction intersecting the first direction and to intersect the two conductors
Data Source
AI summary
An electronic device includes: a circuit device having a specific region including two conductors formed on a surface of the circuit device to be spaced apart from each other by a first distance in a first direction and to have substantially equal widths in the first direction, and at least two solderless portions arranged to be spaced apart from each other by a second distance in a second direction intersecting the first direction and to intersect the two conductors; and an electronic component including two electrodes soldered to the two conductors, respectively, between the at least two solderless portions.