Elongated Via Connection Structure for Electromigration Reduction

The conductive layer is designed with different local structures: a first conductive pattern with larger width at the connection portion to the via conductor, and a second conductive pattern with smaller width elsewhere. This local variation in geometry optimizes current distribution at the critical connection zone while maintaining standard structure in other areas, thereby improving reliability without excessive overall complexity

The solution addresses the two-dimensional current concentration problem by introducing dimensional variation in the conductive layer width. The connection portion extends in the width direction, creating a gradual transition from the via conductor to the main conductive layer, which disperses current in the lateral dimension and prevents concentration at a single point

The conductive layer is segmented into distinct functional zones: a connection portion with larger width for current dispersion, and a main conductive pattern with smaller width for compact circuit routing. This segmentation allows the current-dispersing function to be localized only where needed at the via conductor connection, avoiding unnecessary area expansion in other circuit regions

The width parameter of the conductive layer is changed locally at the connection portion to be larger than in other areas. This parameter variation optimizes current density distribution at the critical connection zone while keeping the overall circuit board area compact, as the width increase is confined to a minimal region