EM Radiation-Absorbing Layer for OLED Patterning
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for depositing conductive materials in OLED manufacturing are limited by high evaporation temperatures, accuracy issues, and debris creation, making them costly and complex, and are not suitable for all devices with certain topographical features.
Innovation Solution
A semiconductor device with an EM radiation-absorbing layer comprising a discontinuous layer of particle structures, where the deposited material coalesces around seeds, and a patterning coating with a low sticking probability is used to selectively deposit the material, avoiding the need for fine metal masks and reducing debris.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a fine metal mask (FMM) is used during deposition of conductive material, then selective deposition can be achieved, but the process complexity and cost increase due to high evaporation temperatures and mask re-use limitations
Solution Approach 1:
The invention removes the fine metal mask from the deposition process entirely. Instead of using a physical mask to define patterns, the conductive material is deposited over the entire substrate and then selectively removed from regions where it is not needed, thereby eliminating mask-related complexity while achieving the desired pattern accuracy
Solution Approach 2:
The conventional approach deposits material only where needed using a mask. The invention inverts this by depositing material everywhere and then removing it from unwanted regions. This inversion eliminates the need for complex masks and their re-use limitations while maintaining pattern definition capability
2Manufacturing precision
If laser drilling is used to remove unwanted regions of deposited material, then patterns can be formed, but manufacturing yield decreases due to debris creation
Solution Approach 1:
The invention replaces the mechanical laser drilling process with a chemical or plasma-based etching process. This substitution eliminates the debris generation associated with mechanical removal while achieving the same pattern formation objective, thereby improving manufacturing yield without sacrificing pattern accuracy
3Ease of manufacture
If conventional deposition methods are used for conductive material, then electrodes and conductive elements can be formed, but the process is not suitable for devices with certain topographical features
Solution Approach 1:
The invention creates a universal deposition process that works effectively across diverse topographical features. By depositing material conformally over the entire substrate surface and then using selective removal, the process adapts to various device geometries and topographies without requiring modification, thereby achieving both ease of manufacture and broad adaptability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the absorption of EM radiation, reduces reflectance, and improves manufacturing efficiency by allowing precise patterning without the need for complex masking techniques, while maintaining device performance and stability.
Implementation Method 1
a conductive deposited material is deposited thereon, patterned using a patterning coating, which may act as and/or be a nucleation-inhibiting coating (NIC)
Implementation Method 2
The photon-absorbing layer absorbs external light incident thereon and reduces reflection by the panel of such light
Implementation Method 3
An EM radiation-absorbing layer comprising a discontinuous layer of at least one particle structure comprising a deposited material is deposited on a first layer surface
Data Source
AI summary
A semiconductor device that facilitates absorption of EM radiation thereon and a method manufacturing same. The device extends in at least one lateral aspect. An EM radiation-absorbing layer comprising a discontinuous layer of at least one particle structure comprising a deposited material is deposited on a first layer surface. The particle structures facilitate absorption of EM radiation incident thereon and may comprise a seed about which the deposited material may tend to coalesce, and/or comprise the deposited material co-deposited with a co-deposited dielectric material. The EM radiation-absorbing layer may be disposed on a supporting dielectric layer and/or be covered by a covering dielectric layer. A patterning coating having an initial sticking probability against deposition of the deposited and/or a seed material, on a surface of the patterning coating is less than the initial sticking probability against deposition of the deposited and/or seed material on the second layer surface.