EM Shield Vertical Alignment with Passive Device in IC Package
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Solution Overview
Problem
Integrated circuit (IC) packages face limitations in supporting high current due to size constraints, leading to inductors with high resistance and low quality (Q) factors, which can result in large and thick package configurations unsuitable for mobile computing devices, and interference with the circuit.
Innovation Solution
An integrated device package with an electromagnetic (EM) passive device in an encapsulation layer and an EM shield, where the EM shield is partially vertically aligned with the EM passive device to minimize the impact of solder balls and provide a high inductance and Q factor without removing solder balls, thus maintaining structural stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder balls are removed near the inductor to improve inductance and Q factor, then the inductor performance is improved, but the structural stability of the packaging substrate and PCB is compromised
Solution Approach 1:
The patent extracts the inductor from the packaging substrate and places it on the die surface, eliminating the need to remove solder balls from the substrate. This allows the substrate to maintain its full solder ball array for structural stability while the inductor achieves optimal performance on the die with nearby solder balls present.
Solution Approach 2:
The patent transitions the inductor location from the horizontal plane of the packaging substrate to the vertical dimension on the die surface. This dimensional change allows the inductor to coexist with the solder ball array without interference, as the solder balls are now in a different spatial relationship to the inductor.
2Reliability
If the inductor is placed farther from the die to reduce interference with the die circuit, then the die circuit performance is improved, but the package form factor becomes too large for mobile devices
Solution Approach 1:
The patent merges the inductor placement with the die surface, combining what were previously separate locations (inductor on substrate, die on substrate) into a integrated configuration where the inductor is directly on the die. This eliminates the need for additional space on the substrate and reduces overall package footprint.
Solution Approach 2:
By placing the inductor on the vertical surface of the die rather than on the horizontal substrate plane, the patent utilizes three-dimensional space more efficiently. This allows the inductor to be positioned away from interfering circuit elements while maintaining a compact overall package footprint suitable for mobile devices.
3Area of stationary object
If the inductor is placed closer to the die to reduce package size, then the package form factor is improved, but the inductor interferes with the die circuit
Solution Approach 1:
The patent uses vertical placement of the inductor on the die surface rather than horizontal placement on the substrate. This dimensional change allows the inductor to be in close proximity to the die (reducing package size) while being positioned in a location that minimizes electromagnetic interference with the die circuit.
Solution Approach 2:
The patent applies local quality by positioning the inductor in a specific location on the die surface where it can be close to the die for compactness while avoiding areas where it would interfere with circuit operation. The local electromagnetic environment is optimized for both compactness and performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a compact and stable integrated package with improved signal and electrical speed performance, suitable for mobile devices, by reducing the disruptive effects of solder balls on EM passive devices and enhancing inductance and Q factor without compromising structural integrity.
Implementation Method 1
An EM shield is provided in an integrated device package. Specifically, the EM shield is at least partially vertically aligned with the EM passive device, such that the EM shield minimizes an impact of a set of solder balls on the EM passive device.
Data Source
AI summary
Some novel features pertain to an integrated device package that includes a die, an electromagnetic (EM) passive device, an encapsulation layer covering the die and the EM passive device, and a redistribution portion coupling the die and the EM passive device. In some implementations, the EM passive device includes an electromagnetic (EM) passive device. The EM passive device includes a base layer, a via traversing the base layer, a pad coupled to the via, and at least redistribution layer configured to operate as electromagnetic (EM) passive component, where the redistribution layer is coupled to the pad. The redistribution portion of the EM passive device includes at least one redistribution layer that is configured to electrically couple the die to the EM passive device. The redistribution portion includes at least one redistribution layer that is configured as an electromagnetic (EM) shield.