EM Shield for Wafer-Bonded Integrated Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional integrated devices face challenges in reducing form factor while minimizing electromagnetic interference between active and passive devices, particularly in vertical configurations.
Innovation Solution
The integration of an active device and a passive device with a shield comprising bonding contacts, interconnects, vias, and end-of-line interconnects in specific planes to effectively shield electromagnetic waves, reducing interference and enhancing device integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a vertical configuration of one device on top of another device is used, then the form factor is reduced, but electromagnetic interference occurs between devices
Solution Approach 1:
An electromagnetic shield is introduced as an intermediary component between the active device in the first device layer and the passive device in the second device layer. The shield comprises a plurality of bonding contacts, bonding layer contacts, bonding layer interconnects, vias, and end of line interconnects that collectively form a conductive barrier to block electromagnetic fields while maintaining the vertical integrated configuration.
Solution Approach 2:
The electromagnetic shield is positioned locally between specific devices that require protection. The shield structure includes bonding contacts at specific locations, interconnected through bonding layer interconnects and vias, creating localized electromagnetic shielding zones without affecting the overall device architecture or requiring complete reconfiguration of the integrated device.
2Adaptability or versatility
If a side by side configuration of two devices on a common substrate is used, then integration is achieved, but the lateral size increases
Solution Approach 1:
The patent transitions from a lateral (side-by-side) arrangement to a vertical arrangement of devices on the common substrate. The active device is placed in a first device layer while the passive device is placed in a second device layer above it, utilizing the vertical dimension to achieve integration without increasing the lateral footprint of the integrated device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for efficient electromagnetic interference reduction, enabling more compact integrated devices with improved performance by effectively coupling bonding and end-of-line interconnects to ground and shield electromagnetic fields.
Implementation Method 1
a shield comprising a plurality of bonding contacts in a first plane of the first device bonding layer, a plurality of bonding layer contact in a second plane parallel to the first plane, a plurality of bonding layer interconnects in the second plane, a plurality of vias in a third plane parallel to the second plane opposite the first plane, and a plurality of end of line interconnects in a fourth plane parallel to the third plane opposite the second plane
Data Source
AI summary
Improve EM coupling for the wafer-bonding process from a first wafer to a second wafer by a shielding technique. Examples may include building an EM shield implemented by BEOL-stacks/routings, bonding contacts, and TSVs for a closed-loop shielding platform for the integrated device to minimize EM interference from active devices due to eddy currents. The shield may be implemented in the active device layer during a wafer-to-wafer bonding-process that uses two different device layers/wafers, an active device layer/wafer and a passive device layer/wayer. The shield may be designed by the patterned routings for both I/O ports and the GND contacts.