EM Shielding Layer for LC Circuit Interconnects
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Semiconductor devices, particularly those used in high-frequency applications, face challenges with electromagnetic interference (EMI) and radio frequency interference (RFI) which affect their performance and reliability due to the generation or susceptibility of undesired electromagnetic interference.
Innovation Solution
A method of forming semiconductor devices with a shielding layer over the components and interconnect structures to isolate them from EMI and RFI, using modular interconnect structures and encapsulants to create an effective electromagnetic shield, such as a faraday cage configuration with conductive layers and shielding materials like Al, ferrite, or carbonyl iron.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If semiconductor devices are designed for high-frequency applications, then device performance and functionality are improved, but electromagnetic interference and radio frequency interference increase
Solution Approach 1:
The patent applies electromagnetic shielding layers that convert harmful electromagnetic interference into beneficial protection. The shielding layers absorb or reflect EMI and RFI, transforming the harmful electromagnetic environment into a protected space for high-frequency device operation, thereby maintaining device performance while eliminating interference issues
Solution Approach 2:
The patent introduces electromagnetic shielding layers as intermediary structures between the high-frequency semiconductor devices and the external electromagnetic environment. These shielding layers act as mediators that block or absorb electromagnetic interference before it reaches the sensitive device components, allowing high-frequency operation without interference
2Object-affected harmful factors
If electromagnetic shielding is added to semiconductor devices, then EMI and RFI protection is improved, but device complexity increases
Solution Approach 1:
The patent integrates electromagnetic shielding layers that serve multiple functions simultaneously: they provide EMI and RFI protection while also acting as part of the device packaging structure. The shielding layers are incorporated into the existing device architecture, eliminating the need for separate shielding components and reducing overall structural complexity
Solution Approach 2:
The patent merges the electromagnetic shielding function with the device packaging and interconnect structures. The shielding layers are combined with the encapsulant and interconnect elements, creating a unified structure that provides both mechanical support and electromagnetic protection, thereby avoiding additional complexity from separate shielding components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces EMI and RFI interference, enhancing the performance and reliability of semiconductor devices by creating a protective shield that blocks or absorbs electromagnetic interference, thereby improving signal integrity and reducing cross-talk between devices.
Implementation Method 1
forming a shielding layer over the first component, modular interconnect structure, and first interconnect structure
Implementation Method 2
The solution effectively reduces EMI and RFI interference, enhancing the performance and reliability of semiconductor devices by creating a protective shield that blocks or absorbs electromagnetic interference
Data Source
AI summary
A semiconductor device has a first component. A modular interconnect structure is disposed adjacent to the first component. A first interconnect structure is formed over the first component and modular interconnect structure. A shielding layer is formed over the first component, modular interconnect structure, and first interconnect structure. The shielding layer provides protection for the enclosed semiconductor devices against EMI, RFI, or other inter-device interference, whether generated internally or from external semiconductor devices. The shielding layer is electrically connected to an external low-impedance ground point. A second component is disposed adjacent to the first component. The second component includes a passive device. An LC circuit includes the first component and second component. A semiconductor die is disposed adjacent to the first component. A conductive adhesive is disposed over the modular interconnect structure. The modular interconnect structure includes a height less than a height of the first component.