Near-Field EM Simulation for IC Side-Channel Analysis

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Solution Overview

Problem

Side-channel attacks can non-invasively extract sensitive information from devices by exploiting physical emissions like power noise and electromagnetic radiation, making it difficult to model and prevent such information leakage from integrated circuits (ICs) before fabrication.

Innovation Solution

A method for near-field electromagnetic simulation that identifies security-sensitive regions in ICs by simulating EM field strengths for grid partitions based on cryptographic workloads, using a time-domain algorithm to calculate EM field transient waveforms and perform linear superposition of wire currents, allowing for efficient identification and redesign of ICs to mitigate data leakage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If full EM simulation is performed for all wire segments on top metal layers, then accurate side-channel emission analysis is achieved, but computational complexity and simulation time become prohibitive due to vast number of wires (100+ million)

Engineering Contradiction:
ImproveEM emission analysis accuracyVSAvoidsimulation complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent divides the chip into multiple grid partitions and identifies security-sensitive regions that contribute most to EM emissions. By segmenting the simulation domain and focusing computational resources on sensitive regions rather than all 100+ million wires, the method achieves accurate side-channel emission analysis while reducing simulation complexity and time.

Inventive Principle:
Principle #1Segmentation

2Loss of information

If detailed EM simulation is performed for all grid partitions, then complete emission profile is obtained, but computational resources and simulation time increase significantly

Engineering Contradiction:
Improveemission information completenessVSAvoidsimulation efficiency
Core Design Contradiction:
Loss of informationVSProductivity

Solution Approach 1:

The patent applies different simulation strategies to different regions: detailed EM simulation is performed only on identified security-sensitive grid partitions where emissions matter, while non-sensitive regions use simplified models or are excluded. This local quality approach preserves complete emission information for sensitive areas while dramatically improving simulation efficiency.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

Instead of performing exhaustive simulation on all grid partitions, the method performs partial simulation only on the subset of sensitive regions identified through initial analysis. This partial action approach maintains productivity by avoiding unnecessary simulations on non-sensitive areas while still capturing complete emission information from regions that actually contribute to side-channel leakage.

Inventive Principle:
Principle #16Partial or excessive action

3Measurement precision

If EM simulation is performed with high detail for all regions, then accurate identification of emission sources is achieved, but computational resources required become prohibitive

Engineering Contradiction:
Improveemission source identification accuracyVSAvoidcomputational resource consumption
Core Design Contradiction:
Measurement precisionVSUse of energy by moving object

Solution Approach 1:

The patent performs preliminary analysis to identify security-sensitive grid partitions before conducting detailed EM simulation. This preliminary action filters out non-sensitive regions upfront, so that subsequent high-detail simulations are applied only where needed. This approach achieves accurate emission source identification while minimizing computational resource consumption by avoiding detailed simulation of irrelevant regions.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables fast and accurate simulation of EM side-channel emission analysis, reducing computational resources and allowing for pre-fabrication redesigns that minimize sensitive data leakage, thereby enhancing security against side-channel attacks.

Implementation Method 1

contributions of the EM fields from the non-security sensitive regions for the EM side-channel emission analysis are based on a linear superposition of wire currents in the non-security sensitive regions of the IC

Methodology Applied
Scientific EffectLinear superposition:

Implementation Method 2

side-channel attacks can extract secret information from a running chip by exploiting physical emissions such as power noise and electromagnetic (EM) radiation

Methodology Applied
Scientific EffectElectromagnetic radiation:

Data Source

PatentUS11973868B2Systems and methods for a fast near-field electromagnetic simulation methodology for side-channel emission analysis
Publication Date: 2024.04.30 ANSYS INC
  • US11973868B2 patent drawing
  • US11973868B2 patent drawing
  • US11973868B2 patent drawing

AI summary

Methods, machine readable media and systems for near-field electromagnetic simulation for side-channel emission analysis of an integrated circuit (IC) are described. In one embodiment, a method can include the following operations: simulating EM field strengths for a plurality of grid partitions of a circuit area of the IC based on a cryptographic work load applied to a model of the IC; identifying one or more of the grid partitions as a security sensitive region for the IC based on the EM field strengths, wherein one or more grid partitions outside of the security sensitive region are identified as non-security sensitive regions for the IC; and simulating EM fields for the IC to perform the EM side-channel emission analysis, wherein contributions of the EM fields from the non-security sensitive regions for the EM side-channel emission analysis are based on a linear superposition of wire currents in the non-security sensitive regions of the IC.