Embeddable Conductive Structure for IC Thermal and EMI Management
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Solution Overview
Problem
The challenge lies in developing an integrated circuit packaging system that balances increased integration, reduced size, and enhanced reliability while addressing thermal management and electromagnetic interference (EMI) issues, as existing solutions fail to effectively manage heat dissipation and EMI shielding in compact multi-functional electronic devices.
Innovation Solution
The system incorporates an embeddable conductive structure with a non-horizontal portion between a lower and elevated portion, mounted over an integrated circuit device, along with an interposer and encapsulation, providing a thermal conduction path and EMI shielding. This structure includes a recess exposing the interposer and elevated portion for improved thermal management and EMI protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If package assembly techniques combine two or more semiconductor chips in a single package to increase integration and reduce size, then memory density and multi-functionality are improved, but thermal management and EMI shielding become problematic
Solution Approach 1:
The conductive structure extends vertically through multiple levels (lower portion, intermediate portion, upper portion) to provide thermal conduction paths in the Z-direction, enabling heat dissipation from densely packed chips without increasing lateral package dimensions. This dimensional approach resolves the contradiction between compact footprint and thermal management capability.
Solution Approach 2:
The embeddable conductive structure acts as an intermediary thermal management component embedded within the package assembly. It provides dedicated thermal conduction pathways between heat-generating chips and heat sinks, mediating the thermal interaction without requiring direct chip-to-chip thermal contact or external thermal management systems.
2Volume of moving object
If package assembly techniques combine two or more semiconductor chips in a single package to increase integration and reduce size, then memory density and multi-functionality are improved, but EMI shielding becomes problematic
Solution Approach 1:
The embeddable conductive structure performs multiple functions simultaneously: it provides thermal conduction, EMI shielding, and mechanical support. This multi-functionality resolves the contradiction by integrating EMI shielding capability into the existing thermal management infrastructure without requiring separate EMI shielding components that would increase package size.
Solution Approach 2:
The conductive structure utilizes materials with both high thermal conductivity and high electrical conductivity properties. This composite material approach enables simultaneous achievement of effective thermal management and EMI shielding within the compact package structure, as the same material properties that enable heat conduction also provide electromagnetic interference protection.
3Adaptability or versatility
If integration increases while package size decreases, then multi-functionality is improved, but adverse interactions within the package affect circuit functionality
Solution Approach 1:
The package assembly is segmented into distinct functional zones: chip mounting areas, thermal management zones with conductive structures, and EMI shielding regions. This segmentation isolates adverse interactions between different functional elements while maintaining high integration, allowing each component to operate optimally without interfering with others.
4Reliability
If embeddable conductive structure with non-horizontal portion is used for thermal management and EMI shielding, then reliability is improved, but device complexity increases
Solution Approach 1:
The thermal management and EMI shielding functions are merged into a single embeddable conductive structure with non-horizontal portions. This consolidation achieves both thermal conduction and EMI shielding reliability without requiring separate structures, thereby reducing overall device complexity while maintaining enhanced reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively enhances thermal management and EMI shielding, allowing for increased integration and reduced package size while maintaining reliability, by utilizing the embeddable conductive structure to dissipate heat and divert EMI, thus addressing the limitations of existing technologies.
Implementation Method 1
providing a thermal conduction path and EMI shielding
Implementation Method 2
providing a thermal conduction path and EMI shielding
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a package carrier; mounting an integrated circuit device to the package carrier; mounting an embeddable conductive structure, having a non-horizontal portion between a lower portion and an elevated portion and a hole, to the integrated circuit device with the lower portion over the integrated circuit device; mounting an interposer to the lower portion and below the elevated portion; and forming an encapsulation having a recess exposing the interposer and the elevated portion.