Embeddable Modular Sensors for Multi-Parameter Plastic Parts
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Solution Overview
Problem
Existing sensing solutions are bulky, expensive, and difficult to integrate into edge points of systems for concurrent measurement of multiple parameters, leading to cross-sensor interferences and complex data acquisition, particularly in plastic/polymeric parts.
Innovation Solution
Modular sensor designs with embeddable passive modules integrated into products during manufacturing, using polymeric materials, and detachable reading modules for wireless power and data transmission, allowing concurrent sensing and processing of multiple parameters.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional sensing solutions are integrated into plastic parts, then sensing capability is provided, but the device becomes bulky and expensive
Solution Approach 1:
The sensing device is divided into separate functional modules: sensor elements, signal conditioning circuitry, and processing units can be distributed across different locations in the plastic part rather than integrated into a single bulky unit. This segmentation allows each component to be optimally positioned and sized, reducing overall device complexity while maintaining sensing capability.
Solution Approach 2:
The sensing system is designed with universal interfaces and protocols that allow the same basic sensor module to measure multiple parameters (temperature, pressure, strain, etc.) by simply changing the sensor element or configuration, rather than requiring separate dedicated sensors for each parameter. This multi-functionality reduces the number of components needed, making the device less bulky and more cost-effective.
2Adaptability or versatility
If multiple sensing devices are installed for concurrent measurement, then multiple parameters can be measured, but cross-sensor interferences and installation difficulty increase
Solution Approach 1:
Multiple sensor elements capable of measuring different parameters (temperature, pressure, strain, etc.) are integrated into a single unified sensing module with shared signal conditioning and processing circuitry. This merging approach allows concurrent measurement of multiple parameters from the same location without the physical separation and interference issues that arise when multiple separate devices are installed, while maintaining adaptability to measure various parameters.
3Ease of operation
If sensing elements are integrated into plastic parts, then direct sensing is achieved, but manufacturing cost and complexity increase
Solution Approach 1:
Sensing elements are integrated only in the specific local regions of the plastic part where measurement is actually needed, rather than throughout the entire component. The sensor elements are embedded during the plastic molding process at precise locations, allowing direct sensing where required while keeping the rest of the manufacturing process simple and cost-effective. This localized integration maintains ease of operation for direct sensing without significantly increasing manufacturing complexity.
Data Source
AI summary
Modular sensor configurations utilize an embeddable sensor module configured for integration into a product or device, or a technical element thereof, for in situ sensing at least one property or condition associated with the product or device, or its technical element, or with a substance contained, processed or streamed therethrough. The embeddable sensor module includes one or more sensor elements that sense the at least one property or condition, and circuitry for generating measurement data/signals indicative of the at least one property or condition, and for transmitting the generated measurement data/signals to an external device. The embeddable sensor module can be powered and activated by signals received from an external device. Such sensing structures/arrays can utilize embeddable sensor modules integrated into a product or device and an external device configure to externally power and activate the embeddable sensor modules to cause them to generate and transmit the measurement data/signals.