Embeddable SiC-Carbon Fiber Sensors for 600°C Contact Measurement

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Solution Overview

Problem

Existing sensors and electronics are not compatible with high and ultra-high temperature environments, and the fabrication of high-quality inorganic fibers, such as SiC fibers, is challenging and expensive, limiting their use in extreme temperature applications.

Innovation Solution

Development of a ceramic temperature sensor with a heterogenous fiber formed of two materials, including a silicon carbide junction, capable of contact temperature measurements up to 600°C, and operating as a diode or thermocouple depending on temperature, fabricated using hyperbaric laser-directed chemical vapor deposition (HP-LCVD).

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conventional sensors and electronics are used in high temperature environments, then cost and ease of manufacture are improved, but temperature compatibility and reliability deteriorate

Engineering Contradiction:
Improveease of manufactureVSAvoidtemperature compatibility
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent changes the material parameters by using silicon carbide (SiC) instead of conventional semiconductor materials, enabling the sensor to operate at temperatures exceeding 600°C while maintaining electrical functionality and reliability in high-temperature environments

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs composite material structures including heterogenous fibers with SiC and other materials, combining the high-temperature stability of ceramics with the electrical properties needed for sensing, thus achieving both temperature compatibility and manufacturability

Inventive Principle:
Principle #40Composite materials

2Temperature

If high-quality inorganic fibers such as SiC fibers are fabricated, then temperature resistance is improved, but manufacturing complexity and cost increase

Engineering Contradiction:
Improvetemperature resistanceVSAvoidfabrication complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent segments the fiber structure into heterogenous components with different materials and compositions, allowing each segment to contribute specific properties such as temperature resistance, electrical conductivity, or mechanical flexibility, thereby simplifying the overall fabrication process

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent creates multi-functional fibers that simultaneously provide structural support, electrical conduction, and temperature sensing capabilities, reducing the need for separate components and simplifying the device architecture

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Quantity of substance

If ferromagnetic materials are loaded into fibers at high concentrations, then magnetic properties are improved, but fiber flexibility and shapeability deteriorate

Engineering Contradiction:
Improvemagnetic material concentrationVSAvoidfiber flexibility
Core Design Contradiction:
Quantity of substanceVSShape

Solution Approach 1:

The patent applies local quality by concentrating ferromagnetic materials only in specific regions or segments of the fiber where magnetic properties are needed, rather than uniformly throughout, thereby preserving flexibility in other portions of the fiber

Inventive Principle:
Principle #3Local quality

4Measurement precision

If contact temperature measurements are enabled in extreme temperatures, then measurement capability is improved, but sensor compatibility with existing electronics deteriorates

Engineering Contradiction:
Improvetemperature measurement capabilityVSAvoidelectronics compatibility
Core Design Contradiction:
Measurement precisionVSAdaptability or versatility

Solution Approach 1:

The patent introduces intermediary components such as protective coatings, isolation layers, or signal conditioning elements that allow the high-temperature sensor to interface with standard low-temperature electronics, thus maintaining measurement capability while ensuring compatibility with existing electronic systems

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The ceramic sensor can withstand extreme temperatures and provide accurate contact temperature measurements, facilitating process control in high-temperature environments, and can be integrated into structures without metal interconnects, enabling predictive maintenance and failure analysis.

Implementation Method 1

the ceramic device operates as a thermocouple to facilitate measurement of temperatures in excess of 600 degrees Celsius (° C.)

Methodology Applied
Scientific EffectThermocouple effect: Thermocouple

Implementation Method 2

the p-n junction operates as a diode in a first mode to facilitate measurement of temperatures less than 600 degrees Celsius (° C.)

Methodology Applied
Scientific EffectDiode temperature sensing: Diode

Implementation Method 3

fabricated usinghyperbaric laser-directed chemical vapor deposition (HP-LCVD)

Methodology Applied
Scientific EffectChemical vapor deposition: Chemical Vapour Deposition

Data Source

PatentUS20250271309A1Embeddable Ultrahigh Temperature Sensors and Method For Making
Publication Date: 2025.08.28 LEIDOS INC
  • US20250271309A1 patent drawing
  • US20250271309A1 patent drawing
  • US20250271309A1 patent drawing

AI summary

A microstructure device includes a heterogenous fiber formed of two materials having different compositions, the heterogenous fiber including a junction between the first and second materials. The first material is silicon carbide (SiC) and the second material is carbon (C). The junction may form an angle between the first and second materials.