Embeddable SiC-Carbon Fiber Sensors for 600°C Contact Measurement
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing sensors and electronics are not compatible with high and ultra-high temperature environments, and the fabrication of high-quality inorganic fibers, such as SiC fibers, is challenging and expensive, limiting their use in extreme temperature applications.
Innovation Solution
Development of a ceramic temperature sensor with a heterogenous fiber formed of two materials, including a silicon carbide junction, capable of contact temperature measurements up to 600°C, and operating as a diode or thermocouple depending on temperature, fabricated using hyperbaric laser-directed chemical vapor deposition (HP-LCVD).
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional sensors and electronics are used in high temperature environments, then cost and ease of manufacture are improved, but temperature compatibility and reliability deteriorate
Solution Approach 1:
The patent changes the material parameters by using silicon carbide (SiC) instead of conventional semiconductor materials, enabling the sensor to operate at temperatures exceeding 600°C while maintaining electrical functionality and reliability in high-temperature environments
Solution Approach 2:
The patent employs composite material structures including heterogenous fibers with SiC and other materials, combining the high-temperature stability of ceramics with the electrical properties needed for sensing, thus achieving both temperature compatibility and manufacturability
2Temperature
If high-quality inorganic fibers such as SiC fibers are fabricated, then temperature resistance is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent segments the fiber structure into heterogenous components with different materials and compositions, allowing each segment to contribute specific properties such as temperature resistance, electrical conductivity, or mechanical flexibility, thereby simplifying the overall fabrication process
Solution Approach 2:
The patent creates multi-functional fibers that simultaneously provide structural support, electrical conduction, and temperature sensing capabilities, reducing the need for separate components and simplifying the device architecture
3Quantity of substance
If ferromagnetic materials are loaded into fibers at high concentrations, then magnetic properties are improved, but fiber flexibility and shapeability deteriorate
Solution Approach 1:
The patent applies local quality by concentrating ferromagnetic materials only in specific regions or segments of the fiber where magnetic properties are needed, rather than uniformly throughout, thereby preserving flexibility in other portions of the fiber
4Measurement precision
If contact temperature measurements are enabled in extreme temperatures, then measurement capability is improved, but sensor compatibility with existing electronics deteriorates
Solution Approach 1:
The patent introduces intermediary components such as protective coatings, isolation layers, or signal conditioning elements that allow the high-temperature sensor to interface with standard low-temperature electronics, thus maintaining measurement capability while ensuring compatibility with existing electronic systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The ceramic sensor can withstand extreme temperatures and provide accurate contact temperature measurements, facilitating process control in high-temperature environments, and can be integrated into structures without metal interconnects, enabling predictive maintenance and failure analysis.
Implementation Method 1
the ceramic device operates as a thermocouple to facilitate measurement of temperatures in excess of 600 degrees Celsius (° C.)
Implementation Method 2
the p-n junction operates as a diode in a first mode to facilitate measurement of temperatures less than 600 degrees Celsius (° C.)
Implementation Method 3
fabricated usinghyperbaric laser-directed chemical vapor deposition (HP-LCVD)
Data Source
AI summary
A microstructure device includes a heterogenous fiber formed of two materials having different compositions, the heterogenous fiber including a junction between the first and second materials. The first material is silicon carbide (SiC) and the second material is carbon (C). The junction may form an angle between the first and second materials.


