Semiconductor Package Structure With Embedded 3D Inductor Routing
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Solution Overview
Problem
Existing semiconductor package structures face challenges in optimizing the performance of passive components like inductors due to difficulties in balancing distance and size requirements when integrated with power sources.
Innovation Solution
A semiconductor package structure that includes a protection layer encapsulating an electronic component and an inductance component, where the inductance component is integrated within and extends from the protection layer, reducing the power routing path and enhancing inductance, and is electrically connected to a power source and capacitance components to regulate power effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the passive component size is increased to enhance performance, then the inductance performance is improved, but the distance between power source and passive component cannot be shortened
Solution Approach 1:
The inductance component is designed with a three-dimensional structure that extends vertically through the protection layer. The component includes a first portion embedded in the protection layer and a second portion protruding from the top surface, utilizing the vertical dimension to achieve both large inductance value and short distance to power source simultaneously
2Loss of energy
If the distance between power source and passive component is shortened, then the power routing path is reduced, but the passive component size cannot be increased
Solution Approach 1:
The inductance component is nested within the protection layer structure, with its first portion embedded in the protection layer and electrically connected to the power source. This nesting allows the component to be positioned very close to the power source while maintaining adequate inductance value through its extended vertical structure
Data Source
AI summary
A semiconductor package structure is provided. The semiconductor package structure includes an electronic component, and an inductance component. The protection layer encapsulates the electronic component and has a top surface and a bottom surface. The top surface and the bottom surface collectively define a space to accommodate the electronic component. The inductance component outflanks the space from the top surface and the bottom surface of the protection layer.