Embedded 3D Hybrid Optoelectronic Interconnects for Compact PCB Integration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing 3D optoelectronic devices have limitations due to non-embedded electrical and optical chips, leading to large footprints, high costs, and suboptimal performance, making them unsuitable for portable products.
Innovation Solution
A 3D IC system with embedded optoelectronic components, including a transmitter and receiver, integrated within a printed circuit board (PCB) or organic laminated substrate, utilizing an embedded optical polymer waveguide and 3D stacked chip architecture to minimize footprint and enhance performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optical chips are packaged in a 2D thick module with large holes on PCB, then optical interconnections can be established, but the system requires collimating or focusing lenses resulting in poor electrical and optical performance and higher costs
Solution Approach 1:
The patent transitions from 2D packaging to 3D integrated packaging, stacking optical and electrical chips vertically within the PCB substrate. This dimensional change eliminates the need for external lenses and large PCB holes, as the optical waveguide directly connects the laser source and photodetector in three-dimensional space, improving both performance and simplifying the package structure.
Solution Approach 2:
The patent embeds the optical chip stack (laser source, waveguide, photodetector) and electrical chip stack within the PCB substrate itself, nesting multiple functional components inside the board structure. This integration eliminates external packaging elements and reduces the overall system footprint while maintaining optical interconnection functionality.
2Area of stationary object
If 2D system on chip technique is used to reduce size, then footprint is reduced, but flexibility is limited and fabrication process becomes challenging with different materials
Solution Approach 1:
The patent employs 3D stacking to integrate different materials (GaAs for optical chips, Si for PCB substrate) vertically rather than horizontally. This approach maintains small footprint while enabling flexible material combination, as each material layer can be optimized for its specific function without the constraints of 2D co-fabrication.
Solution Approach 2:
The patent divides the system into separate optical and electrical chip stacks that can be fabricated using different materials and processes independently. These segmented modules are then integrated through 3D stacking and bonding, allowing material flexibility while maintaining compact form factor.
3Ease of manufacture
If 3D IC techniques are used for better integration, then cost and labor are reduced, but electrical and optical chips must be embedded which increases manufacturing complexity
Solution Approach 1:
The patent performs preliminary bonding and alignment of the optical chip stack and electrical chip stack before final integration into the PCB substrate. This preliminary assembly allows for pre-verification of optical alignments and electrical connections, reducing the precision requirements during the final embedding process and simplifying manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves low-cost, high-performance, and low-profile optoelectronic packaging with reduced material and fabrication costs, enabling small form factor and improved optical, electrical, and thermal performance for chip-to-chip interconnects.
Implementation Method 1
an embedded optical polymer waveguide
Implementation Method 2
Vertical Cavity Surface Emitting Laser (VCSEL) devices
Implementation Method 3
a photo detector in the receiver
Data Source
AI summary
An optoelectronic apparatus is described herein, including a transmitter, a receiver, and an optical waveguide, all of which are embedded in a PCB. The transmitter includes a laser generator and other circuits for generating electrical and optical signals, which are transmitted through the waveguide to the receiver. The receiver includes circuits and detectors for detecting and converting the optical signals to electrical signals. The circuit and optical components of the transmitter and receiver are integrated in 3D hybrid chip sets where the chip components are stacked in a 3D structure. Because all of the circuit and optical components are embedded in the PCB, the apparatus is made very compact and suitable for implementation in portable products.