Embedded Acoustic Resonator Substrate for Compact Wireless Filtering
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge is to develop a substrate with integrated acoustic resonators that can be compactly designed to fit within small wireless devices, while maintaining effective wireless communication performance.
Innovation Solution
The substrate includes an encapsulation layer with embedded first and second acoustic resonators, each with a piezoelectric substrate of different thicknesses, along with dielectric layers and interconnects, allowing for efficient acoustic filtering and compact form factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional integrated devices are used, then wireless communication functionality is provided, but the device size becomes large and consumes excessive space in small wireless devices
Solution Approach 1:
The patent segments the wireless communication functionality into multiple independent acoustic resonators with different thicknesses, each performing specific filtering functions. This segmentation allows the resonators to be compactly arranged within the substrate, reducing overall device volume while maintaining full wireless communication capability through coordinated operation of the segmented components.
Solution Approach 2:
The patent utilizes vertical dimensionality by fabricating acoustic resonators with different thicknesses (first thickness and second thickness) to achieve frequency differentiation. This dimensional approach allows multiple functional resonators to be stacked or arranged vertically within the substrate, significantly reducing the horizontal footprint and overall device size while preserving communication functionality.
2Reliability
If multiple integrated devices are integrated to provide efficient wireless communication, then communication performance improves, but the substrate area increases and cannot fit in small devices
Solution Approach 1:
The patent merges multiple wireless communication functions into a single substrate by integrating multiple acoustic resonators with different thicknesses. Each resonator handles specific frequency filtering tasks, and their combined operation provides robust wireless communication performance. This merging approach consolidates what would traditionally require multiple separate integrated devices into one compact substrate, reducing the required substrate area.
Solution Approach 2:
The patent applies local quality by assigning different thicknesses to different acoustic resonators based on their specific filtering requirements. Each resonator's local structural property (thickness) is optimized for its particular function, enabling efficient space utilization where each component occupies only the space necessary for its specific role, thereby reducing overall substrate area while maintaining communication performance.
3Ease of manufacture
If acoustic resonators with uniform thickness are used, then manufacturing is simplified, but filtering capabilities are limited and cannot provide effective wireless communication
Solution Approach 1:
The patent implements local quality by varying the thickness of different acoustic resonators according to their specific filtering requirements. Each resonator's thickness is locally optimized to achieve the desired resonant frequency and filtering characteristics. This approach maintains manufacturing feasibility through standardized fabrication processes while introducing localized dimensional variations that enable diverse and effective filtering capabilities for reliable wireless communication.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables better form factor and smaller size for wireless devices, while maintaining effective wireless communication performance by utilizing acoustic resonators with varying thicknesses for specific filtering capabilities.
Implementation Method 1
The first acoustic resonator includes a first piezoelectric substrate comprising a first thickness. The second acoustic resonator includes a second piezoelectric substrate comprising a second thickness
Data Source
AI summary
A substrate that includes an encapsulation layer, a first acoustic resonator, a second acoustic resonator, at least one first dielectric layer, a plurality of first interconnects, at least one second dielectric layer, and a plurality of second interconnects. The first acoustic resonator is located in the encapsulation layer. The first acoustic resonator includes a first piezoelectric substrate comprising a first thickness. The second acoustic is located in the encapsulation layer. The second acoustic resonator includes a second piezoelectric substrate comprising a second thickness that is different than the first thickness. The at least one first dielectric layer is coupled to a first surface of the encapsulation layer. The plurality of first interconnects is coupled to the first surface of the encapsulation layer. The plurality of first interconnects is located at least in the at least one first dielectric layer.