Embedded Conductive Antenna Structure for Wider Low-Band Coverage
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Solution Overview
Problem
Conventional 5G millimeter-wave antennas-in-package face a reduction in grounding layer area, leading to decreased shunt capacitance and a shift in operation frequency to higher bands, resulting in narrow operation frequency bands and impaired performance at lower frequency bands.
Innovation Solution
The design incorporates embedded conductive features within the antenna substrate close to the antenna layer's edges, which extend toward the grounding layer, increasing shunt capacitance and improving performance at lower frequency bands, while allowing for fabrication during printed circuit board processes to reduce manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the grounding layer area is reduced in conventional 5G millimeter-wave antennas-in-package, then the antenna size is reduced, but the shunt capacitance decreases and operation frequency shifts to higher bands resulting in narrow operation frequency bands
Solution Approach 1:
The conductive feature extends in the vertical dimension through the antenna substrate, creating a three-dimensional structure that increases shunt capacitance without expanding the planar footprint. This vertical extension allows the antenna to maintain compact size while achieving broader frequency coverage by increasing capacitance in the thickness direction rather than expanding the grounding layer area.
Solution Approach 2:
The conductive feature is embedded within the antenna substrate, nesting the capacitance-enhancing structure inside the existing antenna package volume. This nested configuration allows the substrate to contain both the antenna elements and the embedded conductive feature, maximizing space utilization and increasing shunt capacitance without increasing the overall antenna package size.
2Volume of moving object
If the grounding layer area is reduced, then the antenna size is reduced, but the shunt capacitance decreases leading to impaired performance at lower frequency bands
Solution Approach 1:
The conductive feature extends vertically through the substrate to increase shunt capacitance in the thickness direction, compensating for the reduced grounding layer area. This vertical dimension approach maintains performance at lower frequency bands by providing sufficient capacitance without requiring a larger planar grounding layer, thus preserving reliability while keeping the antenna compact.
3Reliability
If embedded conductive features are added to increase shunt capacitance, then performance at lower frequency bands improves, but device complexity increases
Solution Approach 1:
The conductive feature is integrated directly into the antenna substrate during manufacturing, merging the capacitance-enhancing element with the substrate structure. This integration approach combines multiple functions (substrate support and capacitance provision) into a single unified structure, reducing the number of separate components and simplifying the overall device complexity while maintaining improved performance at lower frequency bands.
Solution Approach 2:
The antenna substrate serves multiple functions: it provides mechanical support for the antenna elements, acts as the grounding layer carrier, and contains the embedded conductive feature that increases shunt capacitance. This multi-functional substrate design eliminates the need for separate capacitance-enhancing components, reducing device complexity while achieving improved performance across frequency bands.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the antenna's performance at lower frequency bands and maintains a compact size, improving bandwidth-to-volume ratios and supporting broader frequency ranges without increasing size.
Implementation Method 1
increased shunt capacitance
Data Source
AI summary
An antenna and an antenna package are provided. The antenna includes an antenna substrate, an antenna layer, a grounding layer and a first conductive feature. The antenna substrate has a top surface and a bottom surface opposite to the top surface. The antenna layer is disposed on the top surface of the antenna substrate. The grounding layer is disposed on the bottom surface of the antenna substrate. The first conductive feature is embedded in the antenna substrate and close to a first edge of the antenna layer. The first conductive feature and the grounding layer are spaced apart by a part of the antenna substrate. The first conductive feature includes a first portion. The angle between the first portion or an extended line of the first portion and the top surface of the antenna substrate is greater than 0 degrees and less than 180 degrees.