Embedded Antenna Module Layout for Low-Coupling Signal Routing
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Solution Overview
Problem
Existing antenna modules suffer from deteriorated performance due to coupling between signal lines and electronic components, which affects antenna characteristics.
Innovation Solution
A multilayer substrate design with specific via conductor configurations and distances is employed to reduce coupling between signal lines and electronic components, utilizing a multilayer structure with conductive and insulating layers to minimize interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If signal lines are routed close to electronic components to reduce device size, then integration density improves, but coupling between signal lines and electronic components increases causing antenna characteristic deterioration
Solution Approach 1:
The patent transitions from planar signal routing to three-dimensional vertical routing through via conductors. Signal lines are routed through multiple layers (first internal conductive layer, second internal conductive layer, antenna layer) separated by insulating layers, moving the signal path to a different spatial dimension away from the electronic component plane, thereby reducing coupling while maintaining compact integration
Solution Approach 2:
Insulating layers are introduced as intermediary materials between the electronic component and signal lines/via conductors. These insulating layers act as electromagnetic shields that reduce direct coupling and interference between the electronic component and surrounding signal structures, allowing closer integration without performance degradation
2Length of moving object
If via conductors are placed close to electronic components to reduce trace length, then signal path length decreases, but coupling between via conductors and electronic components increases causing crosstalk
Solution Approach 1:
Via conductors are positioned in different vertical layers (first internal conductive layer, second internal conductive layer) separated by insulating layers from the electronic component. This vertical dimensionality change shortens the horizontal trace length while maintaining adequate electromagnetic isolation through the layered insulating structure, reducing crosstalk despite close proximity
Solution Approach 2:
The via conductor structure is segmented into multiple sections across different conductive layers (first internal conductive layer, second internal conductive layer, antenna layer). Each segment is separated by insulating layers, breaking up the continuous conductive path and reducing electromagnetic coupling with the electronic component while maintaining signal integrity
Data Source
AI summary
Disclosed herein is an apparatus that includes a multilayer substrate including a plurality of conductive layers and a plurality of insulating layers alternately stacked, and an electronic component having a first signal pad. The plurality of conductive layers include a first internal conductive layer having a first signal pattern, and a second internal conductive layer having a second signal pattern. The plurality of insulating layers include a first insulating layer positioned between the first and second internal conductive layers. The electronic component is embedded in the first insulating layer such that the first signal pad is connected to the first signal pattern. The first and second signal patterns are connected to each other by a first via conductor penetrating through the first insulating layer. The distance between the electronic component and the first via conductor is greater than a diameter of the first via conductor.