Embedded Antenna Semiconductor Package Without Through Vias
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Solution Overview
Problem
The high cost and complex manufacturing process of semiconductor device packages with integrated antennas, due to the need for through vias and costly antenna and substrate processing.
Innovation Solution
A semiconductor device package design that embeds an antenna structure within a dielectric layer, using a conductive pillar to connect the antenna to the semiconductor device, and encapsulating the package with a material that improves transmission efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a through via is used to connect the antenna and electronic components, then electrical connection is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent extracts the antenna structure from the traditional through-via configuration and embeds it within the dielectric layer. The antenna is formed as a separate conductive structure surrounded by dielectric material, eliminating the need for complex through-via fabrication while maintaining electrical connection functionality between the antenna and electronic components
Solution Approach 2:
The antenna structure is nested within the dielectric layer, with the conductive antenna elements embedded inside the insulating dielectric material. This nesting approach allows the antenna to be integrated into the package structure without requiring through-vias to penetrate the entire substrate, thereby reducing manufacturing complexity
2Reliability
If traditional antenna manufacturing is used, then antenna functionality is achieved, but manufacturing cost increases
Solution Approach 1:
The patent merges the antenna manufacturing process with the package substrate fabrication process. The antenna structure is formed using the same dielectric layers and conductive materials as the package substrate, allowing simultaneous fabrication of both components. This integration eliminates separate antenna manufacturing steps and reduces overall production cost
Solution Approach 2:
The dielectric layer serves multiple functions: it provides electrical insulation, mechanical support, and embedding medium for the antenna structure. The conductive pillars serve dual purposes as both structural support and electrical interconnects. This multi-functionality reduces the number of separate components needed, thereby lowering manufacturing cost
3Reliability
If encapsulant material is used to cover the semiconductor device, then device protection is achieved, but transmission efficiency may be reduced
Solution Approach 1:
The patent applies different dielectric materials with different properties in different locations. The dielectric layer surrounding the antenna uses materials with lower dielectric constants to optimize RF transmission, while the encapsulant providing mechanical protection uses materials optimized for protection. This local differentiation allows both device protection and transmission efficiency to be optimized simultaneously
Data Source
AI summary
The present disclosure provides a semiconductor device package. The semiconductor device package includes a dielectric layer. The semiconductor device package further includes an antenna structure disposed in the dielectric layer. The semiconductor device package further includes a semiconductor device disposed on the dielectric layer. The semiconductor device package further includes an encapsulant covering the semiconductor device. The semiconductor device package further includes a conductive pillar having a first portion and a second portion. The first portion surrounded by the encapsulant and the second portion embedded in the dielectric layer.