Embedded Antenna Loop Structure on PCB for Height Minimization
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Solution Overview
Problem
Existing wireless communication devices with embedded antennas require additional manual assembly processes, increasing production costs and instability, and limiting height minimization due to separate assembly methods.
Innovation Solution
A communication device with an embedded antenna that forms a loop structure with connecting and radiating units, allowing it to be integrated onto a printed circuit board using surface mount technology, simplifying assembly and reducing height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual welding or separate assembly methods are used for embedded antennas, then antenna functionality is achieved, but production cost increases and assembly stability decreases
Solution Approach 1:
The patent merges the antenna structure with the printed circuit board by making the antenna plate an integral part of the PCB layer structure. The antenna is formed using the same lamination and printing processes as the PCB, eliminating separate assembly steps. This integration ensures consistent electrical characteristics and eliminates manual welding variability, directly resolving the contradiction between manufacturing ease and assembly stability.
Solution Approach 2:
The printed circuit board serves dual functions: as the structural substrate and as the antenna radiating element. The PCB layers are designed to perform both signal transmission and electromagnetic radiation functions simultaneously. This multi-functionality eliminates the need for separate antenna components and assembly processes, reducing both cost and improving stability.
2Ease of manufacture
If traditional embedded antenna assembly methods are used, then antenna functionality is achieved, but production cost increases due to additional assembly processes
Solution Approach 1:
The antenna manufacturing process is merged with the PCB manufacturing process. Both are produced simultaneously through lamination, drilling, and printing operations in a single production line. This eliminates the need for separate antenna assembly facilities and labor, directly reducing production costs while increasing overall productivity.
Solution Approach 2:
The antenna pattern is pre-formed during the PCB lamination and printing stages, before final assembly. The antenna conductive traces are created as part of the PCB circuit pattern, so no additional antenna-specific manufacturing steps are required later. This preliminary formation of the antenna structure eliminates subsequent assembly costs and improves productivity.
3Length of moving object
If separate antenna and PCB assembly is used, then antenna functionality is achieved, but device height is increased
Solution Approach 1:
The antenna structure is nested within the PCB layer structure. The antenna radiating elements are formed using the same layered construction as the PCB, with antenna traces embedded within the PCB thickness. This nesting approach eliminates the need for additional height to accommodate separate antenna components, directly reducing device height while maintaining functionality.
Solution Approach 2:
The antenna and PCB are merged into a single integrated structure with shared materials and construction processes. The antenna conductive layers are part of the PCB laminate stack-up, eliminating the need for separate mounting height. This integration directly reduces overall device height while the standardized PCB process maintains manufacturing simplicity.
Data Source
AI summary
A communication device with an embedded antenna includes a printed circuit board and an embedded antenna including at least one radiating unit, at least one feeding unit, where each feeding unit is coupled to a corresponding one of the at least one radiating unit and the printed circuit board, and a connecting unit coupled to the at least one radiating unit including a first connecting portion and a second connecting portion. The connecting unit and the at least one radiating unit form a loop structure such that the embedded antenna is capable of covering one side of the printed circuit board.