Embedded Antenna Semiconductor Package Millimeter Wave Design
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Solution Overview
Problem
Current semiconductor packages require complex manufacturing processes and have increased electrical connection distances between antennas and semiconductor chips in the millimeter wave band, leading to higher losses and difficulties in power feeding structures.
Innovation Solution
A semiconductor package design with an embedded main antenna and an auxiliary antenna on the outer surface, where the main antenna is electrically connected to the semiconductor chip, and the auxiliary antenna is coupled to the main antenna, reducing the electrical distance and enhancing radiation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the antenna is disposed significantly adjacent to the semiconductor package in the related art, then the electrical connection distance is reduced, but the manufacturing process becomes complicated and the power feeding structure becomes complex
Solution Approach 1:
The patent merges the antenna and semiconductor package into a single integrated structure where the antenna is formed within the packaging substrate itself. This integration eliminates the need for separate antenna manufacturing and mounting processes, thereby reducing manufacturing complexity while maintaining short electrical connection distance between the antenna and semiconductor chip.
Solution Approach 2:
The packaging substrate serves multiple functions: it provides mechanical support for the semiconductor chip, acts as a sealing structure, and functions as the antenna structure itself. This multi-functionality reduces the overall device complexity by eliminating the need for separate antenna components and their associated power feeding structures.
2Loss of energy
If the antenna is disposed significantly adjacent to the semiconductor package, then electrical connection distance is reduced, but the power feeding structure becomes complicated and difficult to analyze
Solution Approach 1:
The power feeding structure is integrated into the antenna design itself, with the antenna conductor patterns directly connected to the semiconductor chip bonding pads through the substrate. This eliminates complex external power feeding structures and makes the power delivery path straightforward and easy to analyze.
3Ease of manufacture
If the antenna is embedded in an inner portion of the semiconductor package, then manufacturing is simplified, but radiation efficiency may be reduced
Solution Approach 1:
The substrate is designed with localized high-permittivity regions around the antenna structure to enhance radiation efficiency. By adjusting the permittivity distribution in specific areas rather than uniformly throughout the substrate, the patent maintains ease of manufacturing while improving antenna performance.
Solution Approach 2:
The patent optimizes antenna radiation efficiency by adjusting substrate parameters such as permittivity, thickness, and conductor pattern geometry. These parameter changes allow the embedded antenna to achieve high radiation efficiency while maintaining the manufacturing simplicity of an integrated package structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies manufacturing, reduces electrical losses, and improves antenna radiation efficiency and gain, particularly in the millimeter wave band, by minimizing the distance between the antenna and the semiconductor chip while maintaining protection from external environments.
Implementation Method 1
The main antenna and the auxiliary antenna may transceive a high frequency in a millimeter band through the coupling.
Data Source
AI summary
There is provided a semiconductor package, and more particularly, a semiconductor package including an antenna embedded in an inner portion thereof. The semiconductor package includes: a semiconductor chip; a main antenna disposed to be adjacent to the semiconductor chip and electrically connected thereto; a sealing part sealing both of the semiconductor chip and the main antenna; and an auxiliary antenna formed on an outer surface of the sealing part and coupled to the main antenna.