Embedded Antenna Substrate for 5G Signal Reception
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Solution Overview
Problem
Conventional 4G mobile communications face challenges in accommodating the expected 1000-fold increase in mobile data traffic due to limited frequency coverage and high path loss of millimeter waves, necessitating the development of substrates with embedded antennas that can efficiently receive concentrated signals while minimizing defects and ensuring performance.
Innovation Solution
A substrate with an electronic component, including a frame, through hole, wiring portions, and an antenna layer formed on a photo imageable dielectric material, featuring a main antenna layer connected to an RF IC chip and a dummy antenna layer, with a via connecting the layers to reduce misalignment and thermal warpage, and an insulating layer for external electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If millimeter wave antennas are mounted to receive concentrated signals in specific directions, then signal reception capability is improved, but path loss increases due to higher frequency characteristics
Solution Approach 1:
The patent transitions from conventional planar antenna designs to a three-dimensional embedded antenna structure integrated within the substrate thickness direction. The antenna is positioned at different heights and depths within the substrate, utilizing the Z-dimension to create spatial diversity and improve signal reception while compensating for millimeter wave path loss through enhanced directional gain.
Solution Approach 2:
The antenna is nested within the substrate structure, with the conductive pattern embedded in insulating layers and surrounded by additional substrate material. This nested configuration allows the antenna to be integrated into the device housing while maintaining its electromagnetic functionality and reducing interference from external environments.
2Ease of manufacture
If electronic components are mounted on substrate surfaces, then assembly is simplified, but signal transmission performance deteriorates due to interference and loss
Solution Approach 1:
The patent merges the antenna structure with the substrate itself, making the substrate serve dual functions as both the mounting platform for electronic components and the housing for the antenna element. This integration eliminates the need for separate antenna housings and reduces the number of assembly steps while maintaining signal transmission performance through optimized electromagnetic pathways.
Solution Approach 2:
The patent introduces carefully designed via structures and grounding patterns as intermediary elements between the antenna and surrounding components. These intermediaries provide controlled impedance transitions and electromagnetic shielding that reduce signal loss and interference, allowing close proximity mounting of electronic components without degrading antenna performance.
3Ease of manufacture
If conventional antenna designs are used, then manufacturing processes are simple, but defect occurrence increases and performance reliability decreases
Solution Approach 1:
The antenna conductive patterns and insulating layers are formed simultaneously with the substrate manufacturing process using pre-designed PCB fabrication techniques. The via holes for grounding and signal connections are drilled and plated during standard substrate production, eliminating the need for post-assembly antenna installation and reducing the risk of manufacturing defects.
Solution Approach 2:
The patent optimizes antenna performance by carefully controlling geometric parameters such as conductor trace width, spacing, via diameter, and layer thickness. These parameter adjustments are made within the existing manufacturing process capabilities, allowing performance enhancement without requiring new manufacturing technologies or increasing process complexity.
Data Source
AI summary
Disclosed are substrates having an electronic component, including a frame having a through hole, the electronic component disposed in the through hole, a first wiring portion formed on a surface of the frame and the electronic component, a first layer formed on the first wiring portion, and a second wiring portion formed on the first layer, and the second wiring portion including an antenna layer.