Embedded ASIC Microphone Package Footprint Reduction
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Solution Overview
Problem
Conventional MEMS microphone packages are bulkier due to the need for a large surface area and volume to accommodate both the microphone and integrated circuit, resulting in an increased footprint and volume.
Innovation Solution
The integration of an integrated circuit within the substrate, aligned with a substrate aperture, allows audio signals to enter the package while reducing the overall size by eliminating the need for a separate surface area for the IC, with the microphone and IC connected via wirebonds or contact pads, and a conductive lid forming an electromagnetic shield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the integrated circuit is mounted on the base surface alongside the microphone, then the microphone and IC can be supported and connected, but the footprint and volume of the packaged microphone increases
Solution Approach 1:
The integrated circuit is embedded within the substrate itself, merging the IC with the base structure. This integration eliminates the need for separate mounting space on the base surface, thereby reducing the overall footprint while maintaining electrical connection functionality through substrate conductors
Solution Approach 2:
The integrated circuit is nested within the substrate volume, placing the IC inside the base structure rather than on its surface. This nesting approach allows the IC to occupy internal space rather than external footprint area, effectively reducing the packaged microphone's overall area
2Ease of manufacture
If the interior volume is allocated to accommodate both the microphone and integrated circuit, then both components can be housed, but the available back-volume for acoustic performance decreases
Solution Approach 1:
By merging the integrated circuit with the substrate structure, the IC no longer occupies separate interior volume. This consolidation frees up interior space that can be allocated to back-volume, improving acoustic performance while still accommodating the IC within the substrate's internal structure
Solution Approach 2:
The integrated circuit is transitioned from a surface-mounted configuration (occupying 2D base area and 3D interior volume) to an embedded configuration within the substrate thickness dimension. This dimensional reorganization allows the IC to coexist with increased back-volume by utilizing the substrate's internal depth rather than consuming interior cavity space
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration minimizes the package footprint and volume, maintaining the necessary back-volume while providing effective signal processing and protection for the microphone.
Implementation Method 1
a conductive lid forming an electromagnetic shield
Data Source
AI summary
A packaged microphone has a base, a lid coupled to the base forming an interior, a MEMS microphone secured to the base within the interior, and an integrated circuit embedded in the base. Apertures in the base and integrated circuit are aligned to form an aperture from the exterior of the package to the interior.