Embedded ASIC Sensor Package Using Laser Direct Structuring
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Solution Overview
Problem
Traditional MEMS packaging designs have a large form factor, which becomes a challenge for miniaturization and integration in smaller electronic devices, leading to manufacturing inefficiencies and low yield due to low integration levels.
Innovation Solution
A sensor package with a substrate embedding an application-specific integrated circuit (ASIC) and a microelectromechanical system (MEMS) or edge emitting laser, using laser direct structuring to form conductive layers and traces within a molding compound, allowing for a thinner package design that can be integrated into smaller devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional MEMS packaging designs are used, then the package can be manufactured with current capabilities, but the form factor is large which prevents integration into smaller electronic devices
Solution Approach 1:
The patent combines the MEMS device and ASIC into a single integrated package structure, merging previously separate components into one unified unit. This integration reduces the overall form factor while maintaining manufacturing feasibility through a consolidated design approach that eliminates the need for separate packaging of individual components.
Solution Approach 2:
The ASIC is embedded within the substrate structure, and the MEMS device is positioned on the substrate, creating a nested arrangement where components are housed within each other. This nesting approach maximizes space utilization and reduces the external dimensions of the package while keeping manufacturing processes manageable.
2Productivity
If traditional packaging with separate MEMS and ASIC components is used, then manufacturing can proceed with standard processes, but the low level of integration results in low yield
Solution Approach 1:
By merging the MEMS device and ASIC into a single integrated package, the patent increases the level of integration, which directly addresses the low yield issue. The combined structure allows for better alignment and connection between components, reducing manufacturing defects and improving overall yield while managing complexity through unified design.
3Length of stationary object
If the package height is reduced for miniaturization, then integration into smaller devices becomes possible, but traditional packaging structures cannot achieve this thickness
Solution Approach 1:
The patent transitions from traditional multi-layer vertical stacking to a flattened, planar integration approach. By reorganizing components in a more two-dimensional layout on the substrate, the package achieves reduced height (z-dimension) while maintaining all necessary functional connections, enabling integration into thin electronic devices.
4Length of stationary object
If embedded ASIC structure is implemented, then package thickness is reduced, but laser direct structuring process is required which adds manufacturing steps
Solution Approach 1:
The patent replaces traditional mechanical trace formation methods (such as photolithography and etching) with laser direct structuring. This substitution enables the creation of embedded conductive traces through the substrate without requiring complex multi-step patterning processes, thereby achieving thin package design while managing manufacturing complexity through process innovation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a more compact package design that can be integrated into smaller electronic devices, such as tablets, mobile phones, and laptops, while improving manufacturing efficiency by reducing the overall height and enhancing integration capabilities.
Implementation Method 1
using laser direct structuring to form conductive layers and traces within a molding compound
Data Source
AI summary
Provided is a sensor package with an integrated circuit embedded in a substrate and a sensor die on the substrate. The substrate includes a molding compound that has additives configured to respond to a laser. The integrated circuit is embedded in the molding compound. An opening is through the substrate and is aligned with the sensor die. A lid covers the sensor die and the substrate, forming a cavity. At least one trace is formed on a first surface of the substrate, on an internal sidewall of the opening and on a second surface of the substrate with a laser direct structuring process.