Embedded Audio Microchip for Real-Time Layered Sound Enhancement

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing audio remastering systems do not effectively enhance audio quality for listening through modern portable devices like headphones and earbuds, failing to address the need for both remastering and real-time audio enhancement during playback.

Innovation Solution

An electronic audio device equipped with a microchip that processes audio signals by duplicating the original signal, splitting it into layers, processing each layer differently through equalizers and other electronic equipment, and recombining them for enhanced output, all done in the digital domain within a single integrated circuit.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If audio signals are processed through multiple layers with equalizers and electronic equipment to enhance sound quality, then sound clarity and volume are improved, but device complexity increases

Engineering Contradiction:
Improvesound clarityVSAvoiddevice complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent combines multiple audio processing functions (signal duplication, layering, equalization, compression, limiting) into a single integrated microchip circuit. This merging approach maintains high sound clarity through multi-layer processing while reducing device complexity by consolidating what would otherwise require multiple separate components into one unified device.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The microchip is designed to perform multiple audio processing functions simultaneously - duplicating signals, creating layered outputs, applying equalization, compression, and limiting. This multi-functionality allows the single device to achieve enhanced sound clarity across multiple processing stages without requiring separate specialized components for each function.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Measurement precision

If multiple signal layers are processed and recombined in real-time, then audio enhancement quality is improved, but processing time and computational load increase

Engineering Contradiction:
Improveaudio enhancement qualityVSAvoidprocessing time
Core Design Contradiction:
Measurement precisionVSLoss of time

Solution Approach 1:

The patent implements continuous real-time processing of audio signals through the microchip, maintaining uninterrupted signal flow while applying multiple processing stages. The circuit processes signals continuously as they pass through duplication, layering, equalization, compression, and limiting stages, ensuring audio enhancement occurs without interruption or significant delay.

Inventive Principle:
Principle #20Continuity of useful action

Solution Approach 2:

The microchip performs preliminary signal duplication and layering creation before the main audio processing occurs. By preparing the layered signal structure in advance within the circuit, the system reduces the computational load during real-time processing, allowing faster execution of equalization, compression, and limiting operations on already-structured layers.

Inventive Principle:
Principle #10Preliminary action

3Ease of operation

If all audio processing is done in the digital domain within a single integrated circuit, then ease of operation is improved, but manufacturing precision requirements increase

Engineering Contradiction:
Improveease of operationVSAvoidmanufacturing precision
Core Design Contradiction:
Ease of operationVSManufacturing precision

Solution Approach 1:

The patent replaces traditional analog audio processing mechanisms with digital signal processing within the microchip. This substitution enables easier operation through digital control and programming while the integrated circuit design consolidates multiple digital processing functions into a single manufacturable component, managing the precision requirements through standardized semiconductor fabrication processes.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS10901682B2Electronic device with embedded microchip
Publication Date: 2021.01.26 AVATAR INVESTMENTS LLC
  • US10901682B2 patent drawing
  • US10901682B2 patent drawing
  • US10901682B2 patent drawing

AI summary

An electronic audio device has a microchip has embedded therein, circuitry for enhancing the sound outputted therefrom and which is associated, such as a radio, television, headphones, earbuds and the like.