Embedded Bare-Die Interconnects for Hermetic High-Density Implants
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Solution Overview
Problem
Existing implantable brain-computer interfaces face challenges with large, bulky electronics due to the need for analog-to-digital conversion and signal processing, which increases volume and weight, and sealing becomes difficult as implant size decreases and electrical channel count increases, leading to potential electrical shorting and failure points.
Innovation Solution
A method involving embedding bare die IC chips within a substrate pocket, forming conductive traces, and hermetically sealing them with silicon carbide or diamond coatings, along with a housing to create a compact, high-density interconnect system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional packaged IC chips are used with analog-to-digital conversion and signal processing electronics, then signal processing capability is improved, but device volume and weight increase significantly
Solution Approach 1:
The patent extracts the IC chip from its traditional packaged form and removes unnecessary packaging materials and components. The chip is placed in a hollow of a substrate with only essential connection points exposed, eliminating bulky packaging while retaining signal processing functionality.
Solution Approach 2:
The invention segments the IC chip packaging into essential and non-essential parts. Only the connection points are retained for electrical connection, while the rest of the traditional packaging is removed. The substrate provides minimal structural support and hermetic sealing without full packaging overhead.
2Volume of moving object
If implant size is decreased to reduce volume, then device compactness is improved, but hermetic sealing becomes more difficult and electrical shorting risk increases
Solution Approach 1:
The patent merges the IC chip with the substrate by embedding the chip directly into a hollow of the substrate. The substrate serves multiple functions: structural support, hermetic sealing, and electrical insulation. This integration eliminates gaps and interfaces that would compromise sealing reliability in miniaturized devices.
Solution Approach 2:
The IC chip is nested within a hollow cavity of the substrate, creating a compact integrated structure. The substrate encapsulates the chip while providing hermetic sealing through coatings applied over the entire assembly, ensuring reliability despite reduced device dimensions.
3Adaptability or versatility
If connection points are exposed for ribbon cable fabrication, then electrical connection capability is improved, but device complexity and sealing difficulty increase
Solution Approach 1:
The patent applies local quality by exposing connection points only at specific locations on the substrate where electrical connections are needed. The rest of the device maintains hermetic sealing with coatings. This localized exposure minimizes sealing complexity while preserving electrical connection capability for ribbon cable fabrication.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the volume of the implant by embedding IC chips and traces, allowing for a thirty times greater density than typical IC chips, while ensuring hermetic sealing and reducing the risk of electrical shorting.
Implementation Method 1
casting an uncured polymer over the substrate and allowing the polymer to cure into a flat polymer sheet
Implementation Method 2
A layer of silicon carbide or other sealant can be laid down above and below the chip to hermetically seal it from the elements
Data Source
AI summary
Methods of manufacturing a sealed electrical device for embedded integrated circuit (IC) chips are described, as well as the resulting devices themselves. The sealed electrical device is created by removing material from a substrate to form a pocket in the substrate. An unencapsulated, or bare, IC chip can be placed within the pocket with connection pads of the IC chip facing outward. A gap between the IC chip and a side of the pocket can be filled with a filler. An uncured polymer can be cast over the substrate, which can be allowed to cure into a flat polymer sheet. Conductive traces can be patterned on the polymer sheet and to the connection pads of the IC chip. The conductive traces can then be coated with polymer to form a ribbon cable. Substrate can then be removed from underneath the ribbon cable, leaving substrate around the pocket to protect the IC chip.