Embedded Battery Sensor Package for Flexible Wireless Placement
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Solution Overview
Problem
Existing semiconductor devices often face constraints in flexible applications while maintaining low production costs, necessitating a solution that accommodates diverse uses without increasing costs.
Innovation Solution
A semiconductor device with an embedded battery is designed, featuring a sensor system mounted on a leadframe, encapsulated with an encapsulant, and configured for wireless communication, allowing self-contained operation and flexible placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If semiconductor devices are produced with optimized manufacturing processes for low cost, then production costs are reduced, but flexibility and adaptability for diverse applications are constrained
Solution Approach 1:
The device is divided into separate functional modules: a semiconductor die containing the sensor system, a separate battery component, and a leadframe for interconnection. This segmentation allows each component to be manufactured independently using optimized processes, then assembled into a self-powered configuration that adapts to various applications.
Solution Approach 2:
The semiconductor die integrates multiple functions including sensor operation, wireless communication, and power management. The battery is designed with universal mounting capabilities on the leadframe, enabling the same device architecture to serve diverse applications such as industrial sensors, medical devices, and consumer electronics without requiring application-specific manufacturing optimization.
2Adaptability or versatility
If a self-contained sensor system with wireless communication is created, then application flexibility and placement freedom are improved, but device complexity increases
Solution Approach 1:
The patent combines the semiconductor die, battery, and leadframe into a single encapsulated unit. The semiconductor die integrates the sensor system, wireless communication transceiver, and power management circuitry into one chip. The battery is mounted directly on the leadframe and electrically connected to the die, eliminating the need for external power sources or complex wiring harnesses.
Solution Approach 2:
The semiconductor die is nested within the leadframe structure, which in turn is encapsulated with the battery. The die contains integrated circuits that include sensor elements, processing logic, and communication interfaces. This nested arrangement creates a compact self-contained device where each component fits within the structure of the previous component, reducing overall complexity while maintaining full functionality.
Data Source
AI summary
A method of manufacturing a packaged semiconductor device is provided. The method includes affixing a sensor system to a die pad portion of a leadframe. A battery is affixed to the lead frame including a first terminal of the battery affixed to a first leg of the leadframe and a second terminal of the battery affixed to a second leg of the leadframe. An encapsulant encapsulates the sensor system, battery, and leadframe.