Embedded Board-to-Board Connectors for Low-Profile PCB Stacking
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Solution Overview
Problem
The existing board-to-board connection methods in electronic products result in increased height and vulnerability to damage and oxidation due to exposed connectors.
Innovation Solution
A method involving the creation of through holes in circuit boards for housing connectors, using conductive paste for electrical connection, and stacking to reduce height and protect the connectors from damage and oxidation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connectors are installed on board surfaces to connect two circuit boards, then electrical connection is achieved, but the height of the connector increases the total height of the electronic product
Solution Approach 1:
The connector is nested within a through hole formed in the circuit board, with the connector body positioned inside the hole and only the terminal extending outward. This nesting approach allows the connector to be embedded within the board structure rather than mounted on the surface, significantly reducing the overall height while maintaining electrical connectivity between boards.
2Reliability
If connectors are exposed outside the circuit board, then electrical connection is achieved, but the connectors are easy to be damaged and oxidized
Solution Approach 1:
The connector body is positioned inside the through hole of the circuit board, which provides physical protection against damage and isolation from oxidizing environments. Only the essential terminal portion extends outward for connection purposes, minimizing the exposed surface area vulnerable to harmful factors while maintaining functional electrical connectivity.
Solution Approach 2:
The through hole structure creates a protected environment for the connector body, effectively isolating it from the external atmosphere that causes oxidation. This physical barrier approach shields the connector from harmful environmental factors while allowing electrical signals to pass through.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method reduces the overall height of the connected circuit boards and shields the connectors within the through holes, preventing damage and oxidation, while maintaining electrical connectivity.
Implementation Method 1
electrically connecting the first connector to the first soldering pad through the first conductive paste
Data Source
AI summary
The present disclosure provides a method for manufacturing a board-to-board connection structure. The method includes defining a first through hole in a first circuit board, disposing a first connector within the first through hole by a first conductive paste, and connecting the first connector to a second circuit board on which a second connector is installed, thereby realizing a connection of the two circuit boards, and reducing a height of the two circuit boards after the connection. That is, the height of the board-to-board connection structure is reduced. Additionally, since the first connector is received within the first through hole, the first connector is not easy to be damaged and oxidized. The present disclosure further provides a board-to-board connection structure manufactured by the above method.