Component-Embedded Board Frame Alignment for Miniaturization
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Solution Overview
Problem
The existing component-embedded boards face challenges in miniaturization due to potential misalignment of the opening portion, which requires forming larger openings to accommodate misalignment, limiting the miniaturization of the board.
Innovation Solution
A component-embedded board design featuring a frame-shaped conductive layer on both faces of the insulation layer, with the opening portion formed within the inner region of the frame, allowing precise alignment and miniaturization by using laser processing or wet etching, independent of the laser or drill diameter.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the opening portion is formed large to accommodate misalignment, then the reliability of component embedding is improved, but the area of the board increases, preventing miniaturization
Solution Approach 1:
The frame portion is formed in advance on the insulation layer before forming the opening portion. This preliminary structure serves as a reference for positioning the opening portion, eliminating the need to oversize the opening to accommodate alignment errors. The frame acts as a pre-established guide that ensures accurate component embedding without requiring larger tolerances.
Solution Approach 2:
The patent replaces traditional mechanical alignment methods (which require large openings to compensate for misalignment) with a reference-based positioning system. The frame portion serves as a visual and structural reference that guides the formation of the opening portion, substituting the need for oversized mechanical tolerances with a precision reference structure.
2Ease of manufacture
If traditional laser processing or drill processing is used to form the opening portion, then the manufacturing process is simple, but the opening portion size is limited by the laser or drill diameter, preventing miniaturization
Solution Approach 1:
The frame portion is formed first as a reference structure, enabling subsequent formation of a much smaller opening portion than the laser or drill diameter would normally require. The pre-formed frame guides the etching process, allowing the opening to be smaller than the processing tool diameter without causing misalignment issues.
Solution Approach 2:
The patent changes the approach from direct opening formation (where opening size must equal or exceed tool diameter) to reference-guided formation (where opening size can be much smaller than tool diameter). This parameter change in the manufacturing methodology enables miniaturization while maintaining ease of manufacture through wet etching.
3Productivity
If the opening portion is formed without a reference structure, then the manufacturing process is short, but misalignment occurs, reducing manufacturing precision
Solution Approach 1:
The frame portion is formed as a preliminary reference structure that enables precise alignment of the opening portion. This reference structure allows the manufacturing process to maintain high precision without requiring multiple alignment steps or complex positioning procedures, thus preserving productivity while achieving high manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures accurate positioning of the opening portion, reduces machining time, and enhances design flexibility, achieving miniaturization of the component-embedded board without the need for large openings, thereby improving production efficiency and yield.
Implementation Method 1
forming the opening portion by delivering a laser beam to an inner region of the frame portion formed on a first face of the second insulation layer
Implementation Method 2
forming the opening portion by performing wet etching inside the frame portion formed on the first face of the second insulation layer
Data Source
AI summary
Provided is a component-embedded board which includes: a first board including a first insulation layer, a first conductive layer formed on a second face of the first insulation layer, and an interlayer conductive portion penetrating the first insulation layer to be connected to the first conductive layer and protruding from a first face of the first insulation layer; an electric component connected to the interlayer conductive portion; and a second board including a second insulation layer having an opening portion incorporating the electric component, and a second conductive layer formed on at least either one of a first face and a second face of the second insulation layer. The second conductive layer includes a frame portion. The opening portion is formed so as to penetrate the second insulation layer in a thickness direction thereof over the entirety of the inner region of the frame portion.