Embedded Circuit Board Heat Absorbers for Compact Semiconductor Cooling
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Solution Overview
Problem
Existing semiconductor devices face a challenge in managing heat dissipation while maintaining a compact size, as increasing the area of conductor patterns for heat radiation often occupies significant substrate surface area, necessitating larger device sizes or higher temperatures.
Innovation Solution
Incorporating a heat absorbing member thermally connected to internal conductor patterns within the substrate main body to diffuse heat generated by electric components, allowing for efficient heat dissipation without enlarging the device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the area of conductor pattern is increased for heat radiation, then heat dissipation is improved, but device size increases
Solution Approach 1:
The patent transitions from two-dimensional surface-based heat radiation to three-dimensional internal heat absorption by embedding heat absorbing members within the substrate layers. This allows heat to be managed through the thickness dimension of the substrate rather than requiring expanded surface area, effectively resolving the contradiction between heat dissipation and device size.
Solution Approach 2:
The heat absorbing members are nested within the substrate structure, specifically embedded in inner layers between the first and second surfaces. This nesting approach allows the heat management function to be integrated within the existing substrate volume without increasing the external dimensions of the device.
2Temperature
If conductor pattern area is increased, then heat radiation is improved, but device complexity increases
Solution Approach 1:
The patent extracts the heat absorption function from the conductor pattern system and assigns it to dedicated heat absorbing members. This separation allows the conductor patterns to focus on electrical functions while the embedded members handle thermal management, reducing the complexity of conductor pattern design.
Solution Approach 2:
The embedded heat absorbing members serve multiple functions: they absorb heat from adjacent electronic components, conduct heat through the substrate thickness, and provide thermal coupling between different layers. This multi-functionality consolidates what would otherwise require complex conductor pattern arrangements into a single integrated solution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses temperature rise of electric components, enabling compact design and allowing for additional configurations on the substrate surfaces without increasing size.
Implementation Method 1
at least one heat absorbing member arranged inside the substrate main body and thermally connected to the first internal conductor pattern
Data Source
AI summary
A semiconductor device includes a substrate main body having a first surface and a second surface, an electric component arranged in the substrate main body, a first internal conductor pattern arranged in a first circuit layer located between the first surface and the electric component, and at least one heat absorbing member. The at least one heat absorbing member is arranged inside the substrate main body and thermally connected to the first internal conductor pattern.