Embedded Component Board Thermal Management via Metallic Heat-Conducting Layer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional component built-in boards face issues with heat radiation due to lower heat conductivity of conductive paste and potential moisture infiltration and gap formation between the electronic component and heat radiator, leading to reduced reliability.
Innovation Solution
A component built-in board with a metallic heat-conducting layer and thermal via, where the electronic component is closely attached to the heat-conducting layer via an adhesive layer through a hole in the heat-conducting layer, enhancing heat conductivity and attachment reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conductive paste is used to connect the back surface of the electronic component to the heat radiator, then the connection is simple, but the heat radiation characteristics are poor due to lower heat conductivity compared to copper
Solution Approach 1:
The invention changes the material parameter of the connection layer from conductive paste to a metallic layer (such as copper) with higher heat conductivity. This is achieved by forming a metallic heat-conducting layer in the opening of the insulating layer, directly contacting the back surface of the electronic component, thereby improving heat radiation characteristics while maintaining manufacturing feasibility through established metal deposition techniques
Solution Approach 2:
The invention creates a composite structure combining the metallic heat-conducting layer with the insulating layer. The metallic layer provides high heat conductivity for efficient heat dissipation, while the insulating layer provides electrical insulation and structural support, achieving both thermal performance and electrical safety requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat radiation characteristics by securing close attachment between the electronic component and the heat-conducting layer, allowing efficient heat transfer without the need for a conventional heat radiator, enabling miniaturization and increased flexibility in electronic component layout.
Implementation Method 1
at least a portion of the plurality of printed wiring bases include a thermal wiring in the wiring pattern and include a thermal via in the via
Implementation Method 2
a heat-conducting layer configured from a metallic member and closely attached to a surface on an opposite side to an electrode formation surface of the electronic component
Data Source
Figure 1~2
Figure 3~4
Figure 5~6(e)
AI summary
A component built-in board comprises stacked therein a plurality of printed wiring bases having a wiring pattern and a via formed on/ in a resin base thereof, and comprises an electronic component built in thereto, wherein at least a portion of the plurality of printed wiring bases include a thermal wiring in the wiring pattern and include a thermal via in the via, at least one of the plurality of printed wiring bases has formed therein an opening where the electronic component is built, and has formed therein a heat-conducting layer and closely attached to a surface on an opposite side to an electrode formation surface of the electronic component built in to the opening, and the electronic component is fixed in the opening by an adhesive layer stacked on the heat-conducting layer, via a hole formed in a region facing onto the opening of the heat-conducting layer.