Embedded Circuit Board Structure With Thinned Conductor Layer
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Solution Overview
Problem
Existing methods for manufacturing circuit-board structures with embedded components often require complex processes and materials, such as flip-chip methods and multiple lamination steps, which can be inefficient and prone to errors.
Innovation Solution
A method involving the creation of a conductor layer with both a conductor pattern and foil, where the component is attached and the conductor layer is thinned to remove excess material outside the pattern, allowing for mechanical and electrical attachment through various techniques like ultrasonic bonding, soldering, or via formation, with an insulating layer surrounding the component.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If flip-chip methods and multiple lamination steps are used to manufacture circuit-board structures with embedded components, then component attachment and insulation are achieved, but the manufacturing process becomes complex and inefficient
Solution Approach 1:
The patent combines the conductor layer formation and component attachment steps into a single integrated process. The conductor layer is formed on the substrate first, then components are attached directly to this layer, eliminating the need for separate lamination steps and complex multi-layer construction methods described in prior art.
Solution Approach 2:
The conductor layer is formed in advance before component attachment. This preliminary formation of the conductor layer provides a ready-made attachment surface and electrical connection path, simplifying the subsequent component mounting process and eliminating the need for post-attachment conductor formation steps.
2Reliability
If multiple lamination steps are performed to surround components with insulation material, then proper insulation and structural support are achieved, but manufacturing time and process steps increase
Solution Approach 1:
The insulation material application is merged with the conductor layer formation process. The same lamination or deposition process that forms the conductor layer also applies the insulation material in appropriate areas, eliminating separate insulation application steps and reducing total manufacturing cycles.
Solution Approach 2:
The lamination process is designed to serve multiple functions simultaneously: forming conductor layers, providing insulation, and offering structural support. This multi-functional approach replaces the need for multiple specialized steps dedicated to single functions each.
3Manufacturing precision
If conductor material is removed from outside the conductor pattern after component attachment, then precise conductor pattern formation is achieved, but additional processing steps are required
Solution Approach 1:
The conductor pattern is formed with precise boundaries from the beginning during the initial conductor layer formation. Etching masks or selective deposition techniques are used in advance to define the exact conductor pattern geometry, eliminating the need for post-attachment material removal steps.
Solution Approach 2:
Instead of removing conductor material after attachment, the excess conductor material is prevented from forming in the first place. The conductor pattern is extracted or defined selectively during formation, taking out only the necessary conductor portions while leaving insulation material in place to define boundaries.
4Reliability
If existing manufacturing methods are used, then components can be attached to conductor patterns, but material utilization is inefficient and waste is generated
Solution Approach 1:
Conductor material is applied only in the specific locations where electrical connections are needed, rather than forming complete continuous layers. This localized conductor formation eliminates waste material while ensuring reliable electrical connections at all required contact points.
Solution Approach 2:
The conductor layer thickness and material distribution are varied locally to match the specific electrical connection requirements. Thinner or absent conductor material is used where connections are not needed, while sufficient material is provided only at contact points, optimizing material utilization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the manufacturing process, enhances mechanical and electrical reliability, and improves the structural integrity of circuit-board structures by ensuring precise conductor pattern formation and efficient material utilization.
Implementation Method 1
the conductor layer is thinned, in such a way that the conductor material of the conductor layer is removed from outside the conductor pattern
Implementation Method 2
The component is attached to the conductor layer comprising the conductor pattern and conductor foil and, after the attaching of the component, the conductor layer is thinned
Implementation Method 3
allowing for mechanical and electrical attachment through various techniques like ultrasonic bonding, soldering, or via formation
Implementation Method 4
at least one component, which is connected electrically to the conductor patterns. The insulation-material layer surrounding the component is typically part of the basic structure of a circuit-board or module structure, which forms a support for the innermost conductor layers
Data Source
AI summary
The present publication discloses a circuit-board structure, including a conductor layer on an insulating material layer, and a conductor pattern on top of the conductor foil. A component is attached to the conductor foil and the conductor pattern, the component embedded at least in part in adhesive which attaches the component to the insulating material layer. A recess is formed in the conductor foil and the insulating material layer, and contact openings are in the insulating material layer at locations of contact areas of the component. Conductor material of the conductor foil is not present outside the conductor pattern, and the conductor foil is located between the conductor pattern and the insulating material layer.