Embedded Bridge Die Routing for Thin Substrates and Thermal Relief
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Solution Overview
Problem
State-of-the-art mobile application devices face challenges with signal routing and thermal issues due to the increased complexity and number of interconnect levels in modern electronic devices, particularly in package-on-package configurations and side-by-side package configurations.
Innovation Solution
The integration of a bridge die within a core layer of a substrate, which includes conductive traces for signal routing between multiple dies, improves substrate yield and reduces the need for extensive metal layer routing, thereby addressing thermal and signal routing issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a package-on-package configuration is used to maintain small form factor, then the form factor is reduced, but thermal dissipation becomes restricted and thermal issues increase
Solution Approach 1:
The patent transitions from a vertical package-on-package configuration to a lateral side-by-side configuration, changing the spatial dimension of interconnect routing. This dimensional change allows heat to dissipate more effectively while maintaining compact form factor, as the lateral arrangement provides better thermal pathways without increasing vertical height.
2Temperature
If a side-by-side package configuration is used to improve heat dissipation, then thermal issues are relieved, but the number of substrate layers and routing complexity increase
Solution Approach 1:
The patent embeds the bridge die within a cavity in the substrate core layer, creating a nested structure. This nesting approach allows the bridge die to be integrated into the substrate without significantly increasing the overall substrate thickness or requiring additional external routing layers, thus reducing complexity while maintaining the side-by-side configuration's thermal advantages.
3Ease of operation
If high-density routing with long traces is used to connect application processor to memory package, then the side-by-side configuration is achieved, but substrate yield decreases and production cost increases
Solution Approach 1:
The patent introduces a bridge die as an intermediary component that provides dedicated conductive traces for signal routing between the application processor and memory package. This intermediary structure eliminates the need for long, high-density traces through the substrate, thereby improving substrate yield and reducing production costs while maintaining the side-by-side configuration.
Data Source
AI summary
A substrate includes a core layer and a bridge die within the core layer. The bridge die includes first contacts and second contacts. The first contacts are electrically connected to the second contacts via conductive traces of the bridge die. The substrate also includes at least one dielectric layer on a surface of the core layer and the bridge die, third contacts on a surface of the at least one dielectric layer and electrically connected to the first contacts, and fourth contacts on the surface of the at least one dielectric layer and electrically connected to the second contacts.