Embedded Bridge IC Substrate for Dense Interconnect and Heat Control
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Solution Overview
Problem
The challenge lies in creating an integrated circuit (IC) substrate with high functionality and density while efficiently managing heat dissipation and electromagnetic interference, and ensuring mechanical robustness, particularly in the context of miniaturization and increasing electronic component density on component carriers.
Innovation Solution
The development of a silicon-free IC substrate incorporating a reinforced fiber-free dielectric material with an organic bridge element, which includes conductive terminals, electrical interconnections, and dielectric protection, embedded within the substrate, along with a redistribution layer structure for efficient electrical connectivity and thermal dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper traces encapsulated in silicon material are used for embedded interconnections, then electrical connectivity between components is achieved, but manufacturing complexity and cost increase due to high density patterning requirements
Solution Approach 1:
The patent extracts the silicon encapsulation material from the embedded interconnection structure and replaces it with organic dielectric material. This removes the complex silicon processing steps while maintaining the electrical connectivity function through copper traces embedded in the organic material, thereby reducing manufacturing complexity while preserving reliability
Solution Approach 2:
The patent changes the material parameter from silicon-based encapsulation to organic dielectric material. This parameter change enables simpler manufacturing processes while maintaining the essential electrical connectivity function, resolving the contradiction between reliability and manufacturing complexity
2Adaptability or versatility
If electronic component density is increased on component carriers, then functionality is improved, but heat dissipation becomes more difficult
Solution Approach 1:
The patent applies local quality by incorporating thermal management features specifically at high-density interconnection regions. The organic dielectric material with controlled thermal properties is used locally where heat generation is highest, allowing improved functionality in dense areas while managing heat dissipation through material-specific thermal characteristics
Solution Approach 2:
The patent uses composite materials combining copper conductors with organic dielectric materials that have optimized thermal properties. This composite structure enables both high electrical connectivity for functionality and improved heat dissipation through the organic material's thermal management capabilities, resolving the contradiction between functionality and temperature control
3Reliability
If component carriers are designed for harsh conditions, then reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The patent segments the component carrier into distinct functional layers: organic dielectric material for insulation and thermal management, copper traces for electrical connectivity, and reinforced structures for mechanical robustness. This segmentation allows each layer to be optimized independently for its specific function, achieving harsh condition reliability without excessive overall design complexity
Solution Approach 2:
The patent employs composite materials combining organic dielectrics with reinforced structural elements. This composite approach provides both the environmental resistance needed for harsh conditions and a manageable manufacturing process, as each material component can be processed using established techniques
Data Source
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AI summary
There is described an integrated circuit, IC, substrate (100), comprising: i) a reinforced fiber-free dielectric material (110); ii) a bridge element (120) comprising: iia) at least two electrically conductive terminals (121a, 121b), iib) an electrical interconnection (125) that electrically interconnects the at least two electrically conductive terminals (121a, 121b), and iic) a dielectric protection material (122) that encapsulates the electrical interconnection (125), wherein the bridge element (120) is embedded in the reinforced fiber-free dielectric material (110), so that at least two components (140a, 140b), when surface mounted to a first main surface (101) of the IC substrate (100), are electrically connected to the at least two electrically conductive terminals (121a, 121b), respectively; and iii) a redistribution layer, RDL, structure (130), arranged at a second main surface (102) of the IC substrate (100) being opposite to the first main surface (101), and electrically connectable by further electrical interconnections (105) to the at least two components (140a, 140b).