Embedded Bridge Substrate With Integral Passives for Dense Die Interconnects
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Solution Overview
Problem
Current microelectronic assemblies face challenges in achieving dense interconnections between dies and integrating passive components like resistors and capacitors efficiently, leading to increased costs and complexity due to the need for separate prefabrication and assembly of these components.
Innovation Solution
The integration of resistor and capacitor structures directly into an interconnect bridge within the package substrate using semiconductor processing techniques, allowing for dense interconnect routing and reducing the need for external components by fabricating them on the same or different metal layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If passive components are surface-mounted on a backside of a die or on a land side of a circuit board, then assembly is simplified, but device complexity and assembly costs increase due to separate prefabrication and assembly steps
Solution Approach 1:
The patent merges the passive component fabrication process with the interconnect bridge manufacturing process. Both the bridge and passive components are formed simultaneously on the same substrate using the same semiconductor processing techniques, eliminating the need for separate prefabrication and assembly steps. This integration directly reduces device complexity in terms of assembly steps while maintaining ease of manufacture through standardized processes.
Solution Approach 2:
The substrate serves multiple functions: it acts as both the interconnect bridge carrier and the passive component substrate. The same manufacturing infrastructure and processing techniques are used to create both the interconnect structures and the passive components, making the manufacturing process universal and eliminating the need for separate assembly lines for different component types.
2Device complexity
If passive components are integrated directly into the interconnect bridge, then device complexity and assembly costs are reduced, but manufacturing precision requirements increase
Solution Approach 1:
By combining the fabrication of interconnect bridges and passive components into a single simultaneous process, the patent ensures that both structures are created with the same manufacturing precision standards. This approach reduces device complexity by eliminating separate assembly steps while managing manufacturing precision requirements through unified process control rather than requiring higher precision.
3Manufacturing precision
If separate prefabrication and assembly of passive components is used, then manufacturing precision requirements are reduced, but assembly costs and time increase
Solution Approach 1:
The patent merges passive component fabrication with interconnect bridge manufacturing into a single simultaneous process. This integration maintains relaxed manufacturing precision requirements for individual components while dramatically improving productivity by eliminating separate assembly steps. The concurrent fabrication approach ensures that both structures are created in the same process window without requiring post-fabrication assembly operations.
Data Source
AI summary
Microelectronic assemblies, related devices, and methods are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate; a bridge, embedded in the package substrate, wherein the bridge includes an integral passive component, and wherein a surface of the bridge include first contacts in a first interconnect area and second contacts in a second interconnect area; a first die coupled to the passive component via the first contacts in the first interconnect area; and a second die coupled to the second contacts in the second interconnect area.