Embedded Bridge Leg Circuit Assembly Reducing Parasitic Inductance
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Solution Overview
Problem
Existing bridge leg circuit assemblies are bulky, have low power density, and high parasitic inductance, leading to substantial switching losses due to high switching frequencies.
Innovation Solution
A bridge leg circuit assembly with active switch dice directly embedded into a circuit board, coupled through conducting layers and connectors, eliminating the need for pins and reducing parasitic inductance by shortening chip distances, and a full-bridge circuit assembly with multiple active switch dice embedded into an insulating plate with insulated conducting regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If discrete devices are connected through wires or copper busbars, then the circuit assembly is easier to manufacture, but the parasitic inductance increases and power density decreases
Solution Approach 1:
The patent merges the switching devices and connecting structures into a single integrated module. The first and second switching devices are mounted on a circuit board with conducting layers that provide direct electrical connections, eliminating the need for separate wires or busbars. This integration reduces parasitic inductance while maintaining manufacturing feasibility through modular assembly processes.
Solution Approach 2:
The patent employs a nested structure where switching devices are mounted on conducting layers that are themselves embedded in the circuit board. The conducting layers are nested within the board structure, and switching devices are nested on top of these layers, creating a compact hierarchical arrangement that minimizes connection distances and parasitic inductance.
2Ease of manufacture
If discrete devices are connected through wires or copper busbars, then the circuit assembly is easier to manufacture, but the circuit assembly becomes bulky with low power density
Solution Approach 1:
The patent combines multiple discrete components (switching devices, conducting layers, connectors) into a single compact module. The circuit board integrates conducting layers that directly connect switching devices, eliminating the need for external wires and busbars. This merging reduces the overall volume while maintaining ease of manufacture through standardized modular assembly.
Solution Approach 2:
The patent transitions from a planar arrangement of discrete components to a three-dimensional integrated structure. Switching devices are mounted on conducting layers that are embedded within the circuit board, utilizing vertical space rather than only horizontal expansion. This dimensional reorganization reduces the overall footprint and volume of the circuit assembly.
3Ease of manufacture
If discrete devices are connected through wires or copper busbars, then the circuit assembly is easier to manufacture, but the parasitic inductance increases leading to high switching loss
Solution Approach 1:
The patent merges the electrical connection function into the circuit board structure itself through conducting layers. These layers provide direct low-inductance paths between switching devices, eliminating the need for separate connecting elements that would increase parasitic inductance. The integrated design maintains manufacturing simplicity while reducing electrical parasitics.
Solution Approach 2:
The patent extracts the connecting function from separate wires and busbars and integrates it directly into the circuit board's conducting layers. This extraction eliminates the parasitic inductance associated with external connectors while maintaining the ease of manufacture through standardized board fabrication processes.
Data Source
AI summary
A bridge leg circuit assembly comprising: a circuit board, a first active switch die, and a second active switch die. The circuit board having an insulating plate with a first and second side and a first and second conducting layer on the first and second sides of the insulating plate, respectively. The second conducting layer having a first and second conducting region that are insulated from each other. The first active switch die having an opposing first side, facing and coupled with the first conducting region, and an opposing second side, coupled with the second conducting region, which are embedded into the circuit board. The second active switch die having an opposing first side, coupled with the second conducting region, and an opposing second side, coupled with the first conducting layer, which are embedded into the circuit board.