Embedded Bridge PCB Layout for Compact Multi-Die Interconnect
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Solution Overview
Problem
As semiconductor specifications become more complex, the increasing size of dies leads to higher costs and challenges in miniaturizing fab nodes while maintaining effective die-to-die connections in package platforms.
Innovation Solution
A printed circuit board is designed with a bridge embedded within an organic substrate, allowing for die-to-die interconnection and reducing the overall size and cost of the package by embedding a thinner first die with the bridge and mounting additional dies on the wiring board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the size of the die is increased to meet higher semiconductor specifications, then the functional capability is improved, but the cost increases and the package size increases
Solution Approach 1:
The patent divides a large die into multiple smaller dies (first die, second die, third die) with different fab nodes. Each die performs specific functions, and they are connected through embedded bridges within the organic substrate. This segmentation allows meeting high semiconductor specifications through multiple specialized dies rather than one large die, thereby reducing overall package size while maintaining capability.
Solution Approach 2:
The patent embeds bridges within the organic substrate and embeds the first die within the same substrate structure. This nested arrangement allows the connection structures (bridges) to be integrated within the substrate rather than occupying additional external space, reducing the overall package footprint while enabling die-to-die connections.
2Reliability
If the size of the die is increased to maintain effective die-to-die connections, then the connection capability is improved, but the cost increases
Solution Approach 1:
The patent merges the connection function into the organic substrate by embedding bridges within it. Instead of using separate connection structures or larger dies, the substrate itself provides the connection pathway. This integration reduces manufacturing complexity and cost while ensuring reliable die-to-die connections through the embedded bridge structure.
Solution Approach 2:
The embedded bridge acts as an intermediary structure between the first die and other dies. It provides a dedicated connection pathway within the organic substrate, enabling reliable die-to-die connections without requiring larger die sizes or more complex external connection structures, thereby reducing manufacturing cost.
3Reliability
If a traditional package structure is used with separate connection structures, then the connection function is achieved, but the package size increases
Solution Approach 1:
The patent combines the substrate structure and connection structures into a single integrated organic substrate. The bridges are embedded within the substrate layers rather than being separate components. This merging eliminates the need for additional external connection structures, thereby reducing package size while maintaining the connection function.
Solution Approach 2:
The connection bridges are nested within the organic substrate layers. Instead of placing connection structures outside or on top of the substrate, they are embedded within the substrate itself, utilizing the internal space of the substrate structure. This nesting approach reduces the overall package footprint while preserving connection functionality.
Data Source
AI summary
A printed circuit board includes a wiring board including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers, a first die embedded in the plurality of insulating layers, a bridge embedded on the first die in the plurality of insulating layers, a second die mounted on the wiring board, and a third die mounted on the wiring board.