Embedded Bridge Structure in Substrate for Inter-Die Connectivity
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Solution Overview
Problem
Existing semiconductor device configurations are either tall and difficult to manufacture or challenging to produce in smaller sizes, necessitating a novel bridge structure that provides easy electrical connections between dies while being easy to manufacture.
Innovation Solution
An embedded bridge structure within a substrate, comprising a first dielectric layer with embedded interconnects and pads, which provides electrical connections between dies, potentially eliminating the need for a solder resist layer and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a traditional interposer or bridge structure is used to provide electrical connections between dies, then electrical connectivity is achieved, but the device height increases and manufacturing complexity increases
Solution Approach 1:
The bridge structure is merged with the packaging substrate by embedding it within the dielectric layers of the substrate. The bridge structure includes interconnects and dielectric layers that are integrated into the substrate's existing layer structure, eliminating the need for a separate, tall interposer component and reducing overall device height while maintaining electrical connectivity between dies.
Solution Approach 2:
The bridge structure is nested within the packaging substrate's dielectric layers. The bridge structure's dielectric layers and interconnects are positioned between the substrate's outer surfaces, effectively hiding the bridge structure inside the substrate volume. This nesting approach reduces the external dimensions of the device while preserving the electrical connection function.
2Reliability
If a traditional interposer or bridge structure is used to provide electrical connections between dies, then electrical connectivity is achieved, but manufacturing difficulty increases
Solution Approach 1:
The bridge structure is combined with the packaging substrate fabrication process. The same dielectric layers and interconnect formation processes used to create the substrate are also used to create the bridge structure, eliminating the need for separate manufacturing steps and reducing overall manufacturing complexity while ensuring reliable electrical connections.
Solution Approach 2:
The packaging substrate serves multiple functions: it provides the mechanical support structure, contains the electrical interconnects for the dies, and embeds the bridge structure for inter-die connectivity. This multi-functionality reduces the number of separate components and manufacturing processes needed, simplifying production while maintaining reliable electrical connections between dies.
3Volume of moving object
If device size is reduced to create smaller semiconductor devices, then compactness is improved, but manufacturing difficulty increases
Solution Approach 1:
The bridge structure utilizes the vertical dimension by embedding it within the substrate's thickness. The interconnects and dielectric layers are arranged in multiple layers through the substrate depth, allowing electrical connections to be made without increasing the device's planar footprint. This vertical arrangement enables compact devices while maintaining manufacturability through standard multi-layer fabrication processes.
Data Source
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AI summary
Some novel features pertain to a substrate that includes a first dielectric layer and a bridge structure. The bridge structure is embedded in the first dielectric layer. The bridge structure is configured to provide an electrical connection between a first die and a second die. The first and second dies are configured to be coupled to the substrate. The bridge structure includes a first set of interconnects and a second dielectric layer. The first set of interconnects is embedded in the first dielectric layer. In some implementations, the bridge structure further includes a second set of interconnects. In some implementations, the second dielectric layer is embedded in the first dielectric layer. The some implementations, the first dielectric layer includes the first set of interconnects of the bridge structure, a second set of interconnects in the bridge structure, and a set of pads in the bridge structure.