Embedded Bridge IC Package for High-Density Interconnects
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High-density interconnect technologies like silicon interposers are expensive due to the large silicon area required, and existing interconnect bridges embedded in substrates do not efficiently address the need for high computational abilities by integrating multiple dies with high interconnect densities.
Innovation Solution
The integration of an embedded bridge within an integrated circuit package that is electrically and physically coupled with dies and a package substrate, using die interconnect structures such as bumps or pillars, and encapsulated in an electrically insulating material to reduce silicon usage and enhance interconnect density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If silicon interposers are used for high-density interconnects, then interconnect density is improved, but cost increases due to large silicon area
Solution Approach 1:
The patent extracts the bridge functionality from traditional silicon interposer architecture and embeds it directly within the substrate. This eliminates the need for separate silicon interposer components, reducing overall silicon area while maintaining high interconnect density through the embedded bridge structure that provides multiple through-substrate vias and routing paths
Solution Approach 2:
The bridge structure is nested within the substrate, with through-substrate vias and routing paths embedded inside the substrate material. This nesting approach allows the bridge to utilize the substrate's internal volume for interconnect paths, achieving high interconnect density without increasing the substrate's external footprint or requiring additional silicon area
2Ease of manufacture
If traditional substrate routing is used, then manufacturing is simpler, but interconnect density is insufficient for high computational abilities
Solution Approach 1:
The patent transitions from traditional two-dimensional surface routing to three-dimensional embedded routing by creating through-substrate vias and internal routing paths. This dimensional change allows interconnects to traverse through the substrate volume rather than only along the surface, significantly increasing interconnect density while maintaining manufacturing compatibility with standard substrate processing techniques
Data Source
AI summary
Embodiments of the present disclosure are directed towards an integrated circuit (IC) package having first and second dies with first and second input/output (I/O) interconnect structures, respectively. The IC package may include a bridge having first and second electrical routing features coupled to a portion of the first and second I/O interconnect structures, respectively. In embodiments, the first and second electrical routing features may be disposed on one side of the bridge; and third electrical routing features may be disposed on an opposite side. The first and second electrical routing features may be configured to route electrical signals between the first die and the second die and the third electrical routing features may be configured to route electrical signals between the one side and the opposite side. The first die, the second die, and the bridge may be embedded in electrically insulating material. Other embodiments may be described and/or claimed.